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CXR1-04

SURFACE MOUNT GENERAL PURPOSE RECTIFIER

GeneralPurposeRectifier 1AmpGlassPassivatedRectifierChip PROCESSDETAILS ProcessGLASSPASSIVATEDMESA DieSize42.5x42.5MILS DieThickness12.5MILS AnodeBondingPadArea32x32MILS TopSideMetalizationNi/Au-5,000?/2,000? BackSideMetalizationNi/

CentralCentral Semiconductor Corp

美國(guó)中央半導(dǎo)體

CXR1-04

1 Amp Glass Passivated Rectifier Chip

GeneralPurposeRectifier 1AmpGlassPassivatedRectifierChip PROCESSDETAILS ProcessGLASSPASSIVATEDMESA DieSize42.5x42.5MILS DieThickness12.5MILS AnodeBondingPadArea32x32MILS TopSideMetalizationNi/Au-5,000?/2,000? BackSideMetalizationNi/

CentralCentral Semiconductor Corp

美國(guó)中央半導(dǎo)體

CXR1-04_10

SURFACE MOUNT GENERAL PURPOSE SILICON RECTIFIER

DESCRIPTION: TheCENTRALSEMICONDUCTORCXR1-04typeisaSiliconGeneralPurposeRectifierdesignedforapplicationsrequiringhighvoltagecapability. MARKING:FULLPARTNUMBER

CentralCentral Semiconductor Corp

美國(guó)中央半導(dǎo)體

CXR1-04C

1 Amp Glass Passivated Rectifier Chip

GeneralPurposeRectifier 1AmpGlassPassivatedRectifierChip PROCESSDETAILS ProcessGLASSPASSIVATEDMESA DieSize42.5x42.5MILS DieThickness12.5MILS AnodeBondingPadArea32x32MILS TopSideMetalizationNi/Au-5,000?/2,000? BackSideMetalizationNi/

CentralCentral Semiconductor Corp

美國(guó)中央半導(dǎo)體

CXR1-04_15

SURFACE MOUNT GENERAL PURPOSE SILICON RECTIFIER

CentralCentral Semiconductor Corp

美國(guó)中央半導(dǎo)體

CZR1-04

1AmpGlassPassivatedRectifierChip

GeneralPurposeRectifier 1AmpGlassPassivatedRectifierChip PROCESSDETAILS ProcessGLASSPASSIVATEDMESA DieSize42.5x42.5MILS DieThickness12.5MILS AnodeBondingPadArea32x32MILS TopSideMetalizationNi/Au-5,000?/2,000? BackSideMetalizationNi/

CentralCentral Semiconductor Corp

美國(guó)中央半導(dǎo)體

CZR1-04

SURFACEMOUNTHIGHVOLTAGERECTIFIER

GeneralPurposeRectifier 1AmpGlassPassivatedRectifierChip PROCESSDETAILS ProcessGLASSPASSIVATEDMESA DieSize42.5x42.5MILS DieThickness12.5MILS AnodeBondingPadArea32x32MILS TopSideMetalizationNi/Au-5,000?/2,000? BackSideMetalizationNi/

CentralCentral Semiconductor Corp

美國(guó)中央半導(dǎo)體

CZR1-04C

SURFACEMOUNTHIGHVOLTAGERECTIFIER

GeneralPurposeRectifier 1AmpGlassPassivatedRectifierChip PROCESSDETAILS ProcessGLASSPASSIVATEDMESA DieSize42.5x42.5MILS DieThickness12.5MILS AnodeBondingPadArea32x32MILS TopSideMetalizationNi/Au-5,000?/2,000? BackSideMetalizationNi/

CentralCentral Semiconductor Corp

美國(guó)中央半導(dǎo)體

CZR1-04C

1AmpGlassPassivatedRectifierChip

GeneralPurposeRectifier 1AmpGlassPassivatedRectifierChip PROCESSDETAILS ProcessGLASSPASSIVATEDMESA DieSize42.5x42.5MILS DieThickness12.5MILS AnodeBondingPadArea32x32MILS TopSideMetalizationNi/Au-5,000?/2,000? BackSideMetalizationNi/

CentralCentral Semiconductor Corp

美國(guó)中央半導(dǎo)體

HS-QSFP-P1-04

FLYOVER?QSFPCABLEASSEMBLIES

Samtec

Samtec, Inc

詳細(xì)參數(shù)

  • 型號(hào)：

    CXR1-04

  • 制造商：

    CENTRAL

  • 制造商全稱：

    Central Semiconductor Corp

  • 功能描述：

    SURFACE MOUNT GENERAL PURPOSE RECTIFIER

供應(yīng)商型號(hào)品牌批號(hào)封裝庫(kù)存備注價(jià)格
CENTRAL
23+
原廠原包
19960
只做進(jìn)口原裝 終端工廠免費(fèi)送樣
 詢價(jià)
SONY
23+
DIP-8
5000
原裝正品,假一罰十
 詢價(jià)
2023+
QFP
3000
進(jìn)口原裝現(xiàn)貨
 詢價(jià)
XILINX/賽靈思
20+
QFP44
2300
全新原裝,價(jià)格超越代理。
 詢價(jià)
XILINX/賽靈思
22+
QFP44
20000
保證原裝正品,假一陪十
 詢價(jià)
XILINX
2021
BGA
1000
全新、原裝
 詢價(jià)
XILINX/賽靈思
23+
QFP44
10000
原廠授權(quán)一級(jí)代理,專業(yè)海外優(yōu)勢(shì)訂貨,價(jià)格優(yōu)勢(shì)、品種
 詢價(jià)
XILINX/賽靈思
23+
QFP44
9920
原裝正品，支持實(shí)單
 詢價(jià)
XILINX/賽靈思
23+
QFP
3127
現(xiàn)貨
 詢價(jià)
XILINX/賽靈思
21+
QFP44
2315
附帶出貨證明-價(jià)格低于市場(chǎng)百分之五十
 詢價(jià)
更多CXR1-04供應(yīng)商 更新時(shí)間2025-1-22 15:00:00

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