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CY7C1318KV18-300BZXC集成電路(IC)的存儲器規(guī)格書PDF中文資料

CY7C1318KV18-300BZXC
廠商型號

CY7C1318KV18-300BZXC

參數(shù)屬性

CY7C1318KV18-300BZXC 封裝/外殼為165-LBGA;包裝為托盤;類別為集成電路(IC)的存儲器;產(chǎn)品描述:IC SRAM 18MBIT PARALLEL 165FBGA

功能描述

18-Mbit DDR II SRAM Two-Word Burst Architecture

封裝外殼

165-LBGA

文件大小

1.0195 Mbytes

頁面數(shù)量

32

生產(chǎn)廠商 CypressSemiconductor
企業(yè)簡稱

Cypress賽普拉斯

中文名稱

賽普拉斯半導(dǎo)體公司官網(wǎng)

原廠標(biāo)識
數(shù)據(jù)手冊

下載地址一下載地址二到原廠下載

更新時間

2025-1-28 16:00:00

CY7C1318KV18-300BZXC規(guī)格書詳情

Functional Description

The CY7C1316KV18, CY7C1916KV18, CY7C1318KV18, and CY7C1320KV18 are 1.8 V synchronous pipelined SRAM equipped with DDR II architecture. The DDR II consists of an SRAM core with advanced synchronous peripheral circuitry and a 1-bit burst counter.

Features

■ 18-Mbit density (2 M × 8, 2 M × 9, 1 M × 18, 512 K × 36)

■ 333-MHz clock for high bandwidth

■ Two-word burst for reducing address bus frequency

■ Double data rate (DDR) interfaces (data transferred at 666 MHz) at 333 MHz

■ Two input clocks (K and K) for precise DDR timing

? SRAM uses rising edges only

■ Two input clocks for output data (C and C) to minimize clock skew and flight time mismatches

■ Echo clocks (CQ and CQ) simplify data capture in high-speed systems

■ Synchronous internally self-timed writes

■ DDR II operates with 1.5 cycle read latency when DOFF is asserted HIGH

■ Operates similar to DDR-I device with 1 cycle read latency when DOFF is asserted LOW

■ 1.8 V core power supply with HSTL inputs and outputs

■ Variable drive HSTL output buffers

■ Expanded HSTL output voltage (1.4 V–VDD)

? Supports both 1.5 V and 1.8 V I/O supply

■ Available in 165-ball FBGA package (13 × 15 × 1.4 mm)

■ Offered in both Pb-free and non Pb-free packages

■ JTAG 1149.1 compatible test access port

■ Phase locked loop (PLL) for accurate data placement

產(chǎn)品屬性

  • 產(chǎn)品編號:

    CY7C1318KV18-300BZXC

  • 制造商:

    Cypress Semiconductor Corp

  • 類別:

    集成電路(IC) > 存儲器

  • 包裝:

    托盤

  • 存儲器類型:

    易失

  • 存儲器格式:

    SRAM

  • 技術(shù):

    SRAM - 同步,DDR II

  • 存儲容量:

    18Mb(1M x 18)

  • 存儲器接口:

    并聯(lián)

  • 電壓 - 供電:

    1.7V ~ 1.9V

  • 工作溫度:

    0°C ~ 70°C(TA)

  • 安裝類型:

    表面貼裝型

  • 封裝/外殼:

    165-LBGA

  • 供應(yīng)商器件封裝:

    165-FBGA(13x15)

  • 描述:

    IC SRAM 18MBIT PARALLEL 165FBGA

供應(yīng)商 型號 品牌 批號 封裝 庫存 備注 價格
CYPRESS/賽普拉斯
23+
FBGA165
6827
原裝正品代理渠道價格優(yōu)勢
詢價
Infineon Technologies
23+/24+
165-LBGA
8600
只供原裝進(jìn)口公司現(xiàn)貨+可訂貨
詢價
CYPRESS/賽普拉斯
22+
BGA
17800
原裝正品
詢價
CYPRESS
22+
FBGA
10000
原裝正品優(yōu)勢現(xiàn)貨供應(yīng)
詢價
SPANSION(飛索)
2022+原裝正品
FBGA-165(13x15)
18000
支持工廠BOM表配單 公司只做原裝正品貨
詢價
SPANSION(飛索)
2117+
FBGA-165(13x15)
315000
136個/托盤一級代理專營品牌!原裝正品,優(yōu)勢現(xiàn)貨,長
詢價
Cypress Semiconductor Corp
23+
165-FBGA13x15
7300
專注配單,只做原裝進(jìn)口現(xiàn)貨
詢價
Cypress Semiconductor Corp
23+
165-FBGA13x15
7300
專注配單,只做原裝進(jìn)口現(xiàn)貨
詢價
CYPRESS/賽普拉斯
22+
FBGA165
28591
原裝正品現(xiàn)貨
詢價
CYPRESS/賽普拉斯
21+
FBGA165
1709
詢價