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DDR4-2933中文資料etc未分類制造商數據手冊PDF規(guī)格書

DDR4-2933
廠商型號

DDR4-2933

功能描述

Lead-Free&Halogen-Free

文件大小

844.99 Kbytes

頁面數量

47

生產廠商 List of Unclassifed Manufacturers
企業(yè)簡稱

etc2etc未分類制造商

中文名稱

etc2未分類制造商

原廠標識
數據手冊

下載地址一下載地址二

更新時間

2025-1-24 17:02:00

DDR4-2933規(guī)格書詳情

FEATURES

? VDD=VDDQ=1.2V +/- 0.06V

? Fully differential clock inputs (CK, CK) operation

? Differential Data Strobe (DQS, DQS)

? On chip DLL align DQ, DQS and DQS transition with CK

transition

? DM masks write data-in at the both rising and falling ?

edges of the data strobe

? All addresses and control inputs except data, data

strobes and data masks latched on the rising edges of

the clock

? Programmable CAS latency 9, 10, 11, 12, 13, 14, 15,

16, 17, 18, 19 and 20 supported

? Programmable additive latency 0, CL-1, and CL-2 ?

supported (x4/x8 only)

? Programmable CAS Write latency (CWL) = 9, 10, 11,

12, 14, 16, 18

? Programmable burst length 4/8 with both nibble ?

sequential and interleave mode

? BL switch on the fly

? 16banks

? Average Refresh Cycle (Tcase of 0 oC~ 95 oC)

- 7.8 μs at 0oC ~ 85 oC

- 3.9 μs at 85oC ~ 95 oC

? JEDEC standard 78ball FBGA(x4/x8), 78ball FBGA(x16)

? Driver strength selected by MRS

? Dynamic On Die Termination supported

? Two Termination States such as RTT_PARK and

RTT_NOM switchable by ODT pin

? Asynchronous RESET pin supported

? ZQ calibration supported

? TDQS (Termination Data Strobe) supported (x8 only)

? Write Levelization supported

? 8 bit pre-fetch

? This product in compliance with the RoHS directive.

? Internal Vref DQ level generation is available

? Write CRC is supported at all speed grades

? Maximum Power Saving Mode is supported

? TCAR(Temperature Controlled Auto Refresh) mode is

supported

? LP ASR(Low Power Auto Self Refresh) mode is supported

? Fine Granularity Refresh is supported

? Per DRAM Addressability is supported

? Geardown Mode(1/2 rate, 1/4 rate) is supported

? Programable Preamble for read and write is supported

? Self Refresh Abort is supported

? CA parity (Command/Address Parity) mode is supported

? Bank Grouping is applied, and CAS to CAS latency

(tCCD_L, tCCD_S) for the banks in the same or different

bank group accesses are available

? DBI(Data Bus Inversion) is supported(x8)

? This product consist of a half chip of 8Gb die

? A15 address pin is fixed as Low or High

? Support X8 mode only

? tRFC2min and tRFC4min have longer spec value than

normal 4Gb die (Table12)

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