DRA821中文資料德州儀器數(shù)據(jù)手冊(cè)PDF規(guī)格書
DRA821規(guī)格書詳情
1 Features
Processor cores:
? Dual 64-bit Arm? Cortex?-A72 microprocessor
subsystem at up to 2.0 GHz, 24K DMIPS
– 1MB L2 shared cache per dual-core Cortex?-
A72 cluster
– 32KB L1 DCache and 48KB L1 ICache per A72
core
? 4× Arm? Cortex?-R5F MCUs at up to 1.0 GHz with
optional lockstep operation, 8K DMIPS
– 32K I-Cache, 32K D-Cache, 64K L2 TCM
– 2× Arm? Cortex?-R5F MCUs in isolated MCU
subsystem
– 2× Arm? Cortex?-R5F MCUs in general
compute partition
Memory subsystem:
? 1MB of On-Chip L3 RAM with ECC and coherency
– ECC error protection
– Shared coherent cache
– Supports internal DMA engine
? External Memory Interface (EMIF) module with
ECC
– Supports LPDDR4 memory types that comply
with the JESD209-4B specification. (No support
for byte mode LPDDR4 memories, or memories
with more than 17 row address bits)
– Supports speeds up to 3200 MT/s
– 32-bit and 16-bit data bus with inline ECC bus
up to 12.8GB/s
? General-Purpose Memory Controller (GPMC)
? 512KB on-chip SRAM in MAIN domain, protected
by ECC
Virtualization:
? Hypervisor support in Arm? Cortex?-A72
? Independent processing subsystems with Arm?
Cortex?-A72, Arm? Cortex?-R5F with isolated
safety MCU island
? IO virtualization support
– Peripheral Virtualization Unit (PVU) for low
latency high bandwidth peripheral traffic
? Multi-region firewall support for memory and
peripheral isolation
? Virtualization support with Ethernet, PCIe, and
DMA
? Device security (on select part numbers):
? Secure boot with secure runtime support
? Customer programmable root key, up to RSA-4K
or ECC-512
? Embedded hardware security module
? Crypto hardware accelerators – PKA with ECC,
AES, SHA, RNG, DES and 3DES
Functional Safety:
? Functional Safety-Compliant targeted (on select
part numbers)
– Developed for functional safety applications
– Documentation will be available to aid ISO
26262 and IEC 61508 functional safety system
design up to ASIL-D/SIL-3 targeted
– Systematic capability up to ASIL-D/SIL-3
targeted
– Hardware integrity up to ASIL-D/SIL-3 targeted
for MCU Domain
– Hardware integrity up to ASIL-D/SIL-3 targeted
for Extended MCU (EMCU) portion of the Main
Domain
– Hardware integrity up to ASIL-B/SIL-2 targeted
for remainder of the Main Domain
– FFI isolation provided between EMCU and the
remainder of the Main Domain
– Safety-related certification
? ISO 26262 and IEC 61508 planned
? AEC-Q100 qualified on part number variants
ending in Q1
? High-speed interfaces:
– Integrated Ethernet TSN/AVB switch supporting
up to 4 (DRA821U4) or 2 (DRA821U2) external
ports:
? One port supports 5Gb, 10Gb USXGMII/XFI
? All ports support 2.5Gb SGMII
? All ports support 1Gb SGMII/RGMII
? DRA821U4: Any single port can support
QSGMII (using all 4 internal ports)
? Non-blocking wire-rate store and forward
switch
? InterVLAN (Layer3) routing support
? Time synchronization support with IEEE
1588(annex D,E,F)
? TSN/AVB support for traffic scheduling,
shaping
? Port mirroring feature for debug and
diagnostics
? Policing and rate limiting support
– One RGMII/RMII port in safety MCU island
? One PCI-Express? Gen3 controller
– Gen1, Gen2, and Gen3 operation with autonegotiation
– 4× lanes
? One USB 3.1 Gen1 dual-role device subsystem
– Supports type-C switching
– Independently configurable as USB host, USB
peripheral, or USB dual-role device
Automotive interfaces:
? Twenty CAN-FD ports
? 12× Universal Asynchronous Receiver/Transmitter
(UART)
? 11× Serial Peripheral Interfaces (SPI)
? One 8-channel ADC
? 10× Inter-Integrated Circuit ( I2C?)
? 2× Improved Inter-Integrated Circuit ( I3C?)
Audio interfaces:
? 3× Multichannel Audio Serial Port (McASP)
modules
Flash memory interfaces:
? Embedded Multi Media Card ( eMMC? 5.1)
interface
– Support speeds of up to HS400
? One Secure Digital? 3.0/Secure Digital Input
Output 3.0 (SD3.0/SDIO3.0) interfaces
? One Octal SPI / Xccela? / HyperBus? Memory
Controller (HBMC) interface
? 16-nm FinFET technology
? 17.2 mm x 17.2 mm, 0.8 mm pitch, IPC Class 3
PCB
2 Applications
? Automotive gateway
? Vehicle compute
? Body control module
? Telematics control unit
? V2X/V2V
? Factory automation gateways
? Communications equipment
? Industrial transport
? Building Automation Gateway
3 Description
Jacinto? DRA821x processors, based on the Armv8 64-bit architecture, are optimized for gateway systems
with cloud connectivity. The System-on-Chip (SoC) design reduces system-level costs and complexity through
integration—notably, a system MCU, functional safety and security features, and an Ethernet switch for highspeed
communication. Integrated diagnostics and functional safety features are targeted to ASIL-D and SIL 3
certification requirements. Real-time control and low-latency communication are enabled by a PCIe controller
and a TSN capable Gigabit Ethernet switch.
Up to four general-purpose Arm? Cortex?-R5F subsystems can handle low-level, timing-critical processing
tasks and leave the Arm? Cortex?-A72 core unencumbered for advanced and cloud-based applications.
Jacinto DRA821x processors also include the concept of the Extended MCU (eMCU) domain. This domain is a
subset of the processors and peripherals on the main domain targeted at higher functional safety enablement,
such as ASIL-D/SIL-3. The functional block diagram highlights which IP are included in the eMCU. For more
details about eMCU and functional safety, see the DRA821 Safety Manual Processors Texas Instruments
Jacinto? 7 Family of Products (SPRUIX4).
供應(yīng)商 | 型號(hào) | 品牌 | 批號(hào) | 封裝 | 庫存 | 備注 | 價(jià)格 |
---|---|---|---|---|---|---|---|
TI(德州儀器) |
23+ |
FCBGA827 |
7350 |
現(xiàn)貨供應(yīng),當(dāng)天可交貨!免費(fèi)送樣,原廠技術(shù)支持!!! |
詢價(jià) | ||
TI(德州儀器) |
23+ |
NA/ |
8735 |
原廠直銷,現(xiàn)貨供應(yīng),賬期支持! |
詢價(jià) | ||
TI(德州儀器) |
23+ |
FCBGA827 |
6000 |
誠信服務(wù),絕對(duì)原裝原盤 |
詢價(jià) | ||
Panasonic |
20+ |
SSMini3-F3-B |
36800 |
原裝優(yōu)勢(shì)主營型號(hào)-可開原型號(hào)增稅票 |
詢價(jià) | ||
TI |
23+ |
433-BFBGA |
18402 |
確保原裝正品,專注終端客戶一站式BOM配單 |
詢價(jià) | ||
TI |
22+ |
FCBGA (ALF) |
6000 |
原廠原裝,價(jià)格優(yōu)勢(shì)!13246658303 |
詢價(jià) | ||
Panasonic |
16+ |
34300 |
鍏ㄦ柊鍘熻鐜拌揣/浠鋒牸鍙皥! |
詢價(jià) | |||
TI |
23+ |
NA |
5000 |
片上系統(tǒng)(SoC) |
詢價(jià) | ||
TI |
2023 |
NA |
6123 |
原廠代理渠道,正品保障 |
詢價(jià) | ||
TI德州儀器 |
22+ |
24000 |
原裝正品現(xiàn)貨,實(shí)單可談,量大價(jià)優(yōu) |
詢價(jià) |
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