DS1035集成電路（IC）的延遲線規(guī)格書PDF中文資料

Features

Flexible Logic Architecture

? Six devices with 256 to 6864 LUT4s and 19 to 335 I/Os

Ultra Low Power Devices

? Advanced 65 nm low power process

? As low as 19 μW standby power

? Programmable low swing differential I/Os

? Stand-by mode and other power saving options

Embedded and Distributed Memory

? Up to 240 Kbits sysMEM? Embedded Block RAM

? Up to 54 Kbits Distributed RAM

? Dedicated FIFO control logic On-Chip User Flash Memory

? Up to 256 Kbits of User Flash Memory

? 100,000 write cycles

? Accessible through WISHBONE, SPI, I2C and JTAG interfaces

? Can be used as soft processor PROM or as Flash memory

Pre-Engineered Source Synchronous I/O

? DDR registers in I/O cells

? Dedicated gearing logic

? 7:1 Gearing for Display I/Os

? Generic DDR, DDRX2, DDRX4

? Dedicated DDR/DDR2/LPDDR memory with DQS support

High Performance, Flexible I/O Buffer

? Programmable sysIO? buffer supports wide range of interfaces:

– LVCMOS 3.3/2.5/1.8/1.5/1.2

– LVTTL

–PCI

– LVDS, Bus-LVDS, MLVDS, RSDS, LVPECL

– SSTL 25/18

– HSTL 18

– Schmitt trigger inputs, up to 0.5V hysteresis

? I/Os support hot socketing

? On-chip differential termination

? Programmable pull-up or pull-down mode