首頁 >DS276SN/T&R>規(guī)格書列表
零件編號 | 下載&訂購 | 功能描述 | 制造商&上傳企業(yè) | LOGO |
---|---|---|---|---|
TwophasebrushlessfanHalldrivingchip | EGMICROJingjing Microelectronics Co., Ltd 屹晶微電子屹晶微電子有限公司 | EGMICRO | ||
2phasehighvoltageDCMotorDriverIC | FEELINGFeeling Technology Corp. 遠翔科技遠翔科技股份有限公司 | FEELING | ||
2phasehighvoltageDCMotorDriverIC | FEELINGFeeling Technology Corp. 遠翔科技遠翔科技股份有限公司 | FEELING | ||
2phasehighvoltageDCMotorDriverIC | FEELINGFeeling Technology Corp. 遠翔科技遠翔科技股份有限公司 | FEELING | ||
2phasehighvoltageDCMotorDriverIC | FEELINGFeeling Technology Corp. 遠翔科技遠翔科技股份有限公司 | FEELING | ||
N-ChannelPowerMOSFET | ONSEMION Semiconductor 安森美半導體安森美半導體公司 | ONSEMI | ||
ComplementaryOutputHallEffectLatchedSinkDriverIC | GTM 勤益投資控股股份有限公司 | GTM | ||
ComplementaryOutputHallEffectLatchedSinkDriverIC | ETLE-Tech Electronics LTD 亞歷電子亞歷電子有限公司 | ETL | ||
SiliconSchottkyBarrierDiodeforBalancedMixer Features ?Highforwardcurrent,Lowcapacitance. ?HSB276ASwhichisinterconnectedinseriesconfigurationisdesignedforbalancedmixeruse. ?CMPAKpackageissuitableforhighdensitysurfacemountingandhighspeedassembly. | HitachiHitachi Semiconductor 日立日立公司 | Hitachi | ||
SiliconSchottkyBarrierDiodeforBalancedMixer Features ?Highforwardcurrent,Lowcapacitance. ?HSB276ASwhichisinterconnectedinseriesconfigurationisdesignedforbalancedmixeruse. ?CMPAKpackageissuitableforhighdensitysurfacemountingandhighspeedassembly. | RENESASRenesas Technology Corp 瑞薩瑞薩科技有限公司 | RENESAS | ||
SiliconSchottkyBarrierDiode Features ?Highforwardcurrent,Lowcapacitance. ?HSB276ASwhichisinterconnectedinseriesconfigurationisdesignedforbalancedmixeruse. ?CMPAKpackageissuitableforhighdensitysurfacemountingandhighspeedassembly. | KEXINGuangdong Kexin Industrial Co.,Ltd 科信電子廣東科信實業(yè)有限公司 | KEXIN | ||
SILICONSCHOTTKYBARRIERDIODEFORHIGHSPEEDSWITCHING Features ?Highforwardcurrent,Lowcapacitance. ?CMPAK-4Packageissuitableforhighdensity surfacemountingandhighspeedassembly. | HitachiHitachi Semiconductor 日立日立公司 | Hitachi | ||
SiliconSchottkyBarrierDiodeforHighSpeedSwitching Features ?Highforwardcurrent,Lowcapacitance. ?CMPAK-4Packageissuitableforhighdensity surfacemountingandhighspeedassembly. | RENESASRenesas Technology Corp 瑞薩瑞薩科技有限公司 | RENESAS | ||
SiliconSchottkyBarrierDiodeforBalancedMixer Features ?Highforwardcurrent,Lowcapacitance. ?HSB276Swhichisinterconnectedinseries configurationisdesignedforbalancedmixeruse. ?CMPAKpackageissuitableforhighdensity surfacemountingandhighspeedassembly. | HitachiHitachi Semiconductor 日立日立公司 | Hitachi | ||
SiliconSchottkyBarrierDiodeforDetectorandMixer Features ?Highforwardcurrent,Lowcapacitance. ?HSB276Swhichisinterconnectedinseries configurationisdesignedforbalancedmixeruse. ?CMPAKpackageissuitableforhighdensity surfacemountingandhighspeedassembly. | RENESASRenesas Technology Corp 瑞薩瑞薩科技有限公司 | RENESAS | ||
SiliconSchottkyBarrierDiode Features ●Highforwardcurrent,Lowcapacitance. ●HSB276Swhichisinterconnectedinseries configurationisdesignedforbalancedmixeruse. ●CMPAKpackageissuitableforhighdensity surfacemountingandhighspeedassembly. | KEXINGuangdong Kexin Industrial Co.,Ltd 科信電子廣東科信實業(yè)有限公司 | KEXIN | ||
SiliconSchottkyBarrierDiodeforMixer Features ?Highforwardcurrent,Lowcapacitance. ?UltrasmallFlatPackage(UFP)issuitableforsurfacemountdesign. | HitachiHitachi Semiconductor 日立日立公司 | Hitachi | ||
HSC276_03 | RENESASRenesas Technology Corp 瑞薩瑞薩科技有限公司 | RENESAS | ||
SiliconSchottkyBarrierDiode Features ●Highforwardcurrent,Lowcapacitance. ●UltrasmallFlatPackage(UFP)issuitableforsurfacemountdesign. | KEXINGuangdong Kexin Industrial Co.,Ltd 科信電子廣東科信實業(yè)有限公司 | KEXIN | ||
SiliconSchottkyBarrierDiodeforMixer Features ?Highforwardcurrent,Lowcapacitance. ?UltrasmallFlatPackage(UFP)issuitableforsurfacemountdesign. | HitachiHitachi Semiconductor 日立日立公司 | Hitachi |
詳細參數(shù)
- 型號:
DS276SN/T&R
- 功能描述:
RS-232接口集成電路
- RoHS:
否
- 制造商:
Exar
- 數(shù)據(jù)速率:
52 Mbps
- 工作電源電壓:
5 V
- 電源電流:
300 mA
- 工作溫度范圍:
- 40 C to + 85 C
- 安裝風格:
SMD/SMT
- 封裝/箱體:
LQFP-100
供應商 | 型號 | 品牌 | 批號 | 封裝 | 庫存 | 備注 | 價格 |
---|---|---|---|---|---|---|---|
MAXIM |
23+ |
SOIC |
8888 |
專做原裝正品,假一罰百! |
詢價 | ||
DALLAS |
23+ |
SOIC |
65480 |
詢價 | |||
DALLAS |
2405+ |
原廠封裝 |
12500 |
15年芯片行業(yè)經(jīng)驗/只供原裝正品:0755-83267371鄒小姐 |
詢價 | ||
DALLAS |
23+ |
SOIC |
5177 |
現(xiàn)貨 |
詢價 | ||
Maxim Integrated |
21+ |
8-SOIC |
65200 |
一級代理/放心采購 |
詢價 | ||
MAXIM |
20+ |
SOP-8 |
1001 |
就找我吧!--邀您體驗愉快問購元件! |
詢價 | ||
MAXIM/美信 |
標準封裝 |
57218 |
一級代理原裝正品現(xiàn)貨期貨均可訂購 |
詢價 | |||
Maxim |
22+ |
8SOIC |
9000 |
原廠渠道,現(xiàn)貨配單 |
詢價 | ||
Maxim |
21+ |
8SOIC |
13880 |
公司只售原裝,支持實單 |
詢價 | ||
MAXIM/美信 |
23+ |
NA |
154 |
電子元器件供應原裝現(xiàn)貨. 優(yōu)質獨立分銷。原廠核心渠道 |
詢價 |
相關規(guī)格書
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相關庫存
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