首頁 >EB-276>規(guī)格書列表

零件編號下載 訂購功能描述/絲印制造商 上傳企業(yè)LOGO

HSB276AS

SiliconSchottkyBarrierDiode

Features ?Highforwardcurrent,Lowcapacitance. ?HSB276ASwhichisinterconnectedinseriesconfigurationisdesignedforbalancedmixeruse. ?CMPAKpackageissuitableforhighdensitysurfacemountingandhighspeedassembly.

KEXINGuangdong Kexin Industrial Co.,Ltd

科信電子廣東科信實業(yè)有限公司

HSB276AYP

SILICONSCHOTTKYBARRIERDIODEFORHIGHSPEEDSWITCHING

Features ?Highforwardcurrent,Lowcapacitance. ?CMPAK-4Packageissuitableforhighdensity surfacemountingandhighspeedassembly.

HitachiHitachi Semiconductor

日立日立公司

HSB276AYP

SiliconSchottkyBarrierDiodeforHighSpeedSwitching

Features ?Highforwardcurrent,Lowcapacitance. ?CMPAK-4Packageissuitableforhighdensity surfacemountingandhighspeedassembly.

RENESASRenesas Technology Corp

瑞薩瑞薩科技有限公司

HSB276S

SiliconSchottkyBarrierDiodeforBalancedMixer

Features ?Highforwardcurrent,Lowcapacitance. ?HSB276Swhichisinterconnectedinseries configurationisdesignedforbalancedmixeruse. ?CMPAKpackageissuitableforhighdensity surfacemountingandhighspeedassembly.

HitachiHitachi Semiconductor

日立日立公司

HSB276S

SiliconSchottkyBarrierDiodeforDetectorandMixer

Features ?Highforwardcurrent,Lowcapacitance. ?HSB276Swhichisinterconnectedinseries configurationisdesignedforbalancedmixeruse. ?CMPAKpackageissuitableforhighdensity surfacemountingandhighspeedassembly.

RENESASRenesas Technology Corp

瑞薩瑞薩科技有限公司

HSB276S

SiliconSchottkyBarrierDiode

Features ●Highforwardcurrent,Lowcapacitance. ●HSB276Swhichisinterconnectedinseries configurationisdesignedforbalancedmixeruse. ●CMPAKpackageissuitableforhighdensity surfacemountingandhighspeedassembly.

KEXINGuangdong Kexin Industrial Co.,Ltd

科信電子廣東科信實業(yè)有限公司

HSC276

SiliconSchottkyBarrierDiodeforMixer

Features ?Highforwardcurrent,Lowcapacitance. ?UltrasmallFlatPackage(UFP)issuitableforsurfacemountdesign.

HitachiHitachi Semiconductor

日立日立公司

HSC276

HSC276_03

RENESASRenesas Technology Corp

瑞薩瑞薩科技有限公司

HSC276

SiliconSchottkyBarrierDiode

Features ●Highforwardcurrent,Lowcapacitance. ●UltrasmallFlatPackage(UFP)issuitableforsurfacemountdesign.

KEXINGuangdong Kexin Industrial Co.,Ltd

科信電子廣東科信實業(yè)有限公司

HSC276A

SiliconSchottkyBarrierDiodeforMixer

Features ?Highforwardcurrent,Lowcapacitance. ?UltrasmallFlatPackage(UFP)issuitableforsurfacemountdesign.

HitachiHitachi Semiconductor

日立日立公司

詳細參數(shù)

  • 型號：

    EB-276

  • 制造商：

    Dantona Industries

  • 功能描述：

    9 VOLT CARBON ZINC BATTERY 65.1 X 51.6 X 80.2 SNAP CONN

供應商型號品牌批號封裝庫存備注價格
INTEL
19+
DIP
256800
原廠代理渠道,每一顆芯片都可追溯原廠；
 詢價
Phoenix/菲尼克斯
22/23+
連接器
95
優(yōu)勢貨源原裝現(xiàn)貨
 詢價
Matrix Technology Solutions
2022+
原廠原包裝
6800
全新原裝 支持表配單 中國著名電子元器件獨立分銷
 詢價
NEC
1736+
SMD
8529
專營繼電器只做原裝正品假一賠十!
 詢價
NEC
20+
SOP
30500
原裝優(yōu)勢主營型號-可開原型號增稅票
 詢價
NEC
20+
通信繼電器
2890
只做原裝現(xiàn)貨繼電器
 詢價
NEC
2447
SMD
100500
一級代理專營品牌!原裝正品,優(yōu)勢現(xiàn)貨,長期排單到貨
 詢價
NEC
2020+
SMD
880000
明嘉萊只做原裝正品現(xiàn)貨
 詢價
NEC
24+
450
詢價
NEC
23+
SOP
10857
原廠授權一級代理,專業(yè)海外優(yōu)勢訂貨,價格優(yōu)勢、品種
 詢價
更多EB-276供應商 更新時間2025-4-14 16:12:00

相關規(guī)格書

更多

相關庫存

更多