ELJPA3R3MF2中文資料松下數(shù)據(jù)手冊PDF規(guī)格書

HIGH POWER

ELJ-PB Series 1812 Case Size

Features:

? Low DCR and large current capability, suitable for power circuitry

? Wire wound, resin molded chip inductor. (PC, PA, PB types)

? Capable of being Re-flow or flow soldered

? Wide line-up from 1005 to 4532 case sizes

? Good for mounting

Applications:

? AV equipment, Wireless communication equipment and various types of general electronic equipment

GENERAL USE

ELJ-FC Series 1008 Case Size

Features:

? General use wire wound, resin molded chip inducto

? Capable of being Re-fl ow or fl ow soldered

? Wide line-up from 2520 to 4532 case sizes

? Good for mounting

Applications:

? AV equipment, Wireless communication equipment and various types of general electronic equipment