ESC-T794中文資料ENTEGRIS數據手冊PDF規(guī)格書

APPLICATIONS

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Primary Application: ESC T794

? Post-Cu CMP cleans

Other Applications: ESC T700

Series

? Dielectric CMP cleans

? Backside metal and particle

removal

? OSG film cleans

? Pre-deposition cleans

? Polysilicon CMP cleans

? Cu and barrier CMP pad

cleaning and conditioning

FEATURES & BENEFITS

—

? Effective for organic residue

removal

? Cleans hydrophobic dielectrics

without watermarks

? Removes copper contamination

from dielectric surfaces

? Prevents brush loading

? Low copper surface roughness

? Compatible with low-k films

including porous dielectrics

? Effective at ambient

temperatures

? Demonstrated improvements

in TDDB and electromigration

? Global technical applications

support