FBGA中文資料amkor數(shù)據(jù)手冊(cè)PDF規(guī)格書(shū)
| 廠商型號(hào) |
FBGA |
| 功能描述 | Amkor’s ChipArray? Ball Grid Array (CABGA) laminate based packages are compatible with SMT mounting processes worldwide. |
| 文件大小 |
746.51 Kbytes |
| 頁(yè)面數(shù)量 |
2 頁(yè) |
| 生產(chǎn)廠商 | Amkor Technology |
| 企業(yè)簡(jiǎn)稱(chēng) |
amkor |
| 中文名稱(chēng) | Amkor Technology官網(wǎng) |
| 原廠標(biāo)識(shí) |  |
| 數(shù)據(jù)手冊(cè) | |
| 更新時(shí)間 | 2025-3-23 16:40:00 |
| 人工找貨 | FBGA價(jià)格和庫(kù)存，歡迎聯(lián)系客服免費(fèi)人工找貨 |
FBGA規(guī)格書(shū)詳情
FEATURES
Cutting-edge technology and expanding package offerings provide a platform from prototype-toproduction
Copper (Cu) wire interconnect method and high-volume infrastructure at all Amkor CABGA production facilities
Lowest cost using Amkor standard CABGA bill of materials selection
1.5-27 mm body size available
Square or rectangle packages available
4-700 ball/lead counts
0.4, 0.5, 0.65, 0.75, 0.80 & 1.0 mm ball pitch available
JEDEC publication 95 design guide 4.5 (JEP95)
RoHS-6 (green) BOM options for 100% of CABGA family
Thermal conductivity epoxy (8 W/mk) and thermal conductivity compound (3 W/mK) are available
Applications
The ChipArray? package family is applicable for a wide range of semiconductors from high end FPGAs, ASICS to memory, analog, RF devices, MCUs and simple PLDs requiring a package size smaller than conv entional PBGAs or leadframe packages. ChipArray? packages fill the need for the low cost, minimum space, high performance and reliability requirements of mobile and gaming devices, notebooks, personal computers, networking, automotive and industrial applications.
產(chǎn)品屬性
- 型號(hào)：
FBGA
- 制造商：
STATSCHIP
- 制造商全稱(chēng)：
STATSCHIP
- 功能描述：
Fine Pitch Ball Grid Array
| 供應(yīng)商 | 型號(hào) | 品牌 | 批號(hào) | 封裝 | 庫(kù)存 | 備注 | 價(jià)格 |
|---|---|---|---|---|---|---|---|
PANAFLO |
24+ |
35200 |
一級(jí)代理/放心采購(gòu) |
詢價(jià) | |||
24+ |
BGA |
10 |
詢價(jià) | ||||
TOPLINE |
2403+ |
BGA |
11809 |
原裝現(xiàn)貨!歡迎隨時(shí)咨詢! |
詢價(jià) | ||
SHINKO |
22+ |
BGA |
2000 |
進(jìn)口原裝!現(xiàn)貨庫(kù)存 |
詢價(jià) | ||
FATC |
24+ |
BGA84 |
5000 |
全新原裝正品,現(xiàn)貨銷(xiāo)售 |
詢價(jià) | ||
SENSATA TECHNOLOGIES |
23+ |
SMD |
880000 |
明嘉萊只做原裝正品現(xiàn)貨 |
詢價(jià) | ||
23+ |
BGA |
68670 |
##公司主營(yíng)品牌長(zhǎng)期供應(yīng)100%原裝現(xiàn)貨可含稅提供技術(shù) |
詢價(jià) | |||
FATC |
1211+ |
BGA84 |
176 |
一級(jí)代理,專(zhuān)注軍工、汽車(chē)、醫(yī)療、工業(yè)、新能源、電力 |
詢價(jià) | ||
進(jìn)口 |
23+ |
BGA |
8890 |
價(jià)格優(yōu)勢(shì)/原裝現(xiàn)貨/客戶至上/歡迎廣大客戶來(lái)電查詢 |
詢價(jià) | ||
FATC |
22+23+ |
BGA84 |
8000 |
新到現(xiàn)貨，只做原裝進(jìn)口 |
詢價(jià) |
