FCBGA_V01中文資料amkor數(shù)據(jù)手冊(cè)PDF規(guī)格書
| 廠商型號(hào) |
FCBGA_V01 |
| 功能描述 | Amkor FCBGA packages are assembled around state?of?the?art, single unit laminate or ceramic substrates. |
| 文件大小 |
772.49 Kbytes |
| 頁面數(shù)量 |
2 頁 |
| 生產(chǎn)廠商 | Amkor Technology |
| 企業(yè)簡稱 |
amkor |
| 中文名稱 | Amkor Technology官網(wǎng) |
| 原廠標(biāo)識(shí) |  |
| 數(shù)據(jù)手冊(cè) | |
| 更新時(shí)間 | 2025-2-10 18:16:00 |
FCBGA_V01規(guī)格書詳情
FEATURES
Die sizes up to 31 mm
Package sizes from 10 mm to 67.5 mm (85 mm in qualification)
0.4 mm, 0.5 mm, 0.65 mm, 0.8 mm and 1.0 mm pitch BGA footprints
90 μm minimum array bump pitch
<90 μm minimum peripheral bump pitch
Applications
This IC packaging technology is applicable for high pin count a nd/or highperformance ASICs. Large-body FCBGAs provide package solutions for the demands of internet, workstation processors and high bandwidth system communication devices. By incorporating flip chip interconnect technology, packages supporting thousands of connections are enabled in conventional surface mount package sizes. FCBGAs are also the package of cho ice forgaming system processors and graphics, as well as high?end applications processors for leading-edge portable devices.
| 供應(yīng)商 | 型號(hào) | 品牌 | 批號(hào) | 封裝 | 庫存 | 備注 | 價(jià)格 |
|---|---|---|---|---|---|---|---|
MINI |
2021+ |
3000 |
十年專營原裝現(xiàn)貨,假一賠十 |
詢價(jià) | |||
原廠 |
原廠封裝 |
733 |
一級(jí)代理 原裝正品假一罰十價(jià)格優(yōu)勢(shì)長期供貨 |
詢價(jià) | |||
MINI |
24+ |
SMD |
3600 |
MINI專營品牌全新原裝正品假一賠十 |
詢價(jià) | ||
進(jìn)口 |
23+ |
PGA |
8890 |
價(jià)格優(yōu)勢(shì)/原裝現(xiàn)貨/客戶至上/歡迎廣大客戶來電查詢 |
詢價(jià) | ||
24+ |
PGA |
94 |
詢價(jià) | ||||
AMKOY |
22+ |
BGA |
2000 |
進(jìn)口原裝!現(xiàn)貨庫存 |
詢價(jià) | ||
PANDUIT |
新 |
19 |
全新原裝 貨期兩周 |
詢價(jià) | |||
AMKOY |
23+ |
SSOP |
5000 |
原裝正品,假一罰十 |
詢價(jià) | ||
MINI |
24+ |
9000 |
原裝現(xiàn)貨假一賠十 |
詢價(jià) | |||
MINI |
23+ |
6500 |
專注配單,只做原裝進(jìn)口現(xiàn)貨 |
詢價(jià) |
