首頁>FLIPSTACKCSP>規(guī)格書詳情
FLIPSTACKCSP中文資料amkor數(shù)據(jù)手冊(cè)PDF規(guī)格書
| 廠商型號(hào) |
FLIPSTACKCSP |
| 功能描述 | The FlipStack? CSP family utilizes Amkor’s industry leading ChipArray? Ball Grid Array (CABGA) manufacturing capabilities |
| 文件大小 |
728.44 Kbytes |
| 頁面數(shù)量 |
2 頁 |
| 生產(chǎn)廠商 | Amkor Technology |
| 企業(yè)簡稱 |
amkor |
| 中文名稱 | Amkor Technology官網(wǎng) |
| 原廠標(biāo)識(shí) |  |
| 數(shù)據(jù)手冊(cè) | |
| 更新時(shí)間 | 2025-1-9 17:52:00 |
FLIPSTACKCSP規(guī)格書詳情
FEATURES
Package height down to 0.6 mm
Design, assembly and test capabilities that enable stacking combinations of memory, logic and mixed signal type devices
Established package infrastructure with standard CABGA and fcCSP footprints
Consistent product performance with high yields and reliability
Die overhang wirebonding
Low loop wirebonding to 40 μm or less
Pb-free, RoHS compliant and green materials
Passive component integration options
JEDEC standard outlines including MO-192, MO-195, MO-216, MO-219 and MO-298
Applications
FlipStack? CSP technology enables smaller, lighter and more innovative new product form factors at a lower cost. This solution address es a range of design requirements, and enables a wide variety of applications, including portable multimedia devices such as tablets, cell phones and digital cameras.
| 供應(yīng)商 | 型號(hào) | 品牌 | 批號(hào) | 封裝 | 庫存 | 備注 | 價(jià)格 |
|---|---|---|---|---|---|---|---|
INTEL |
05+ |
原廠原裝 |
4616 |
只做全新原裝真實(shí)現(xiàn)貨供應(yīng) |
詢價(jià) | ||
INTEL/英特爾 |
22+ |
BGA |
6852 |
只做原裝正品現(xiàn)貨!或訂貨假一賠十! |
詢價(jià) | ||
SIEM |
23+ |
原廠封裝 |
11888 |
專做原裝正品,假一罰百! |
詢價(jià) | ||
INTEL |
23+ |
65480 |
詢價(jià) | ||||
INTEL |
24+ |
35200 |
一級(jí)代理/放心采購 |
詢價(jià) | |||
FLIR |
22+ |
25000 |
原裝現(xiàn)貨 支持實(shí)單 |
詢價(jià) | |||
FlirCommercialSystems-FL |
新 |
6 |
全新原裝 貨期兩周 |
詢價(jià) | |||
Intel |
22+ |
9000 |
原廠渠道,現(xiàn)貨配單 |
詢價(jià) | |||
Intel |
24+ |
352BGA |
6768 |
進(jìn)口原裝現(xiàn)貨 |
詢價(jià) | ||
INTEL |
2021+ |
SMD |
100500 |
一級(jí)代理專營品牌!原裝正品,優(yōu)勢(shì)現(xiàn)貨,長期排單到貨 |
詢價(jià) |
