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FMF750DC-66A中文資料POWERINT數(shù)據(jù)手冊PDF規(guī)格書

FMF750DC-66A
廠商型號

FMF750DC-66A

功能描述

Gate Driver for 1.2 kV to 3.3 kV Half-Bridge Power Modules Electrical I/O Interface

文件大小

1.28065 Mbytes

頁面數(shù)量

29

生產(chǎn)廠商 Power Integrations, Inc.
企業(yè)簡稱

POWERINT

中文名稱

荷蘭帕沃英蒂格盛有限公司官網(wǎng)

原廠標(biāo)識
數(shù)據(jù)手冊

下載地址一下載地址二到原廠下載

更新時間

2024-12-23 13:00:00

FMF750DC-66A規(guī)格書詳情

Product Highlights

Highly Integrated, Compact Footprint

? Ready-to-use gate driver solution optimized for power

modules from 1200 V up to 3300 V blocking voltage

? Supporting IGBT, Hybrid (Si-IGBT/SiC-Diode) and Full-SiC

MOSFET power modules

? Dual channel gate driver

? Electrical primary-side interface with reinforced isolation

? Optimized for paralleling of up to 4 power modules

? Wide input supply voltage range +15 V to +48 V

? -40 °C to +85 °C operating ambient temperature

Protection and Safety Features

? Undervoltage lock-out (UVLO) protection for primary-side

(low voltage side) and secondary-side (high voltage side)

? Short-circuit protection with Advanced Soft Shut Down

(ASSD)

? NTC temperature sensing with reinforced isolated digital

output signal (PWM-coded)

? DC-link voltage measurement with reinforced isolated

digital output signal (PWM-coded)

? Applied double sided conformal coating

Full Safety and Regulatory Compliance

? 100 production partial discharge test

? 100 production HIPOT compliance testing

? Reinforced insulation in accordance with EN 50124-1 and

IEC 61800-5-1

Description

The SCALE-iFlex gate driver family consists of a central

Isolated Master Control (IMC) and Module Adapted Gate

Driver (MAG) together with a cable set. The IMC is designed

for operation of power modules with a blocking voltage of up

to 3300 V, whereas the MAGs are available in various variants

optimized for different power modules of different suppliers

and chip technologies in the voltage classes of 3300 V.

SCALE-iFlex enables easy paralleling of up to four power

modules1 providing high flexibility and system scalability

with minimum development effort.

Integrated NTC temperature and DC-link voltage signals

with reinforced isolation are available as substitution for

discrete system level sensors.

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