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FS950R08A6P2B分立半導(dǎo)體產(chǎn)品的晶體管-IGBT-模塊規(guī)格書PDF中文資料

FS950R08A6P2B
廠商型號

FS950R08A6P2B

參數(shù)屬性

FS950R08A6P2B 封裝/外殼為模塊;包裝為管件;類別為分立半導(dǎo)體產(chǎn)品的晶體管-IGBT-模塊;產(chǎn)品描述:IGBT MODULE 750V 950A

功能描述

HybridPACK? Drive Module
IGBT MODULE 750V 950A

封裝外殼

模塊

文件大小

2.02032 Mbytes

頁面數(shù)量

16

生產(chǎn)廠商 Infineon Technologies AG
企業(yè)簡稱

Infineon英飛凌

中文名稱

英飛凌科技股份公司官網(wǎng)

原廠標(biāo)識
數(shù)據(jù)手冊

原廠下載下載地址一下載地址二到原廠下載

更新時間

2025-1-9 23:00:00

FS950R08A6P2B規(guī)格書詳情

FS950R08A6P2B屬于分立半導(dǎo)體產(chǎn)品的晶體管-IGBT-模塊。由英飛凌科技股份公司制造生產(chǎn)的FS950R08A6P2B晶體管 - IGBT - 模塊絕緣柵雙極晶體管 (IGBT) 是三端功率半導(dǎo)體器件,主要用作電子開關(guān),兼具高效率和快速切換優(yōu)點。作為模塊,IGBT 配置為非對稱式橋; 升壓、降壓和制動斬波器;全橋、三電平和三相逆變器。有些器件內(nèi)置了用于監(jiān)控溫度的 NTC 熱敏電阻。IGBT 模塊可根據(jù)最大功率、集電極電流、集射擊穿電壓和配置進行區(qū)分。

Electrical Features

?Blocking voltage 750V

?Low VCEsat

?Low Switching Losses

?Low Qg and Crss

?Low Inductive Design

?Tvj op = 150°C

?Short-time extended Operation Temperature

Tvj op = 175°C

Mechanical Features

?4.2kV DC 1sec Insulation

?High Creepage and Clearance Distances

?Compact design

?High Power Density

?Direct Cooled PinFin Base Plate

?Guiding elements for PCB and cooler assembly

?Integrated NTC temperature sensor

?PressFIT Contact Technology

?RoHS compliant

?UL 94 V0 module frame

Description

The HybridPACKTM Drive is a very compact

six-pack module (750V/950A) optimized for hybrid

and electric vehicles. The power module

implements the new EDT2 IGBT generation, which

is an automotive Micro-Pattern Trench-Field-Stop

cell design optimized for electric drive train

applications. The chipset has benchmark current

density combined with short circuit ruggedness and

increased blocking voltage for reliable inverter

operation under harsh environmental conditions.

The EDT2 IGBTs also show excellent light load

power losses, which helps to improve system

efficiency over a real driving cycle. The EDT2 IGBT

was optimized for applications with switching

frequencies in the range of 10 kHz.

The new HybridPACKTM Drive power module family

comes with mechanical guiding elements

supporting easy assembly processes for customers.

Furthermore, the press-fit pins for the signal

terminals avoid additional time consuming selective

solder processes, which provides cost savings on

system level and increases system reliability. The

direct cooled baseplate with PinFin structure and

optimized ceramic material in the

FS950R08A6P2B product best utilizes the

implemented chipset and shows superior thermal

characteristics. Due to the high clearance &

creepage distances, the module family is also well

suited for increased system working voltages and

supports modular inverter approaches.

產(chǎn)品屬性

更多
  • 產(chǎn)品編號:

    FS950R08A6P2BBPSA1

  • 制造商:

    Infineon Technologies

  • 類別:

    分立半導(dǎo)體產(chǎn)品 > 晶體管 - IGBT - 模塊

  • 系列:

    HybridPACK?

  • 包裝:

    管件

  • IGBT 類型:

    溝槽型場截止

  • 配置:

    三相反相器

  • 不同?Vge、Ic 時?Vce(on)(最大值):

    1.35V @ 15V,450A

  • 輸入:

    標(biāo)準(zhǔn)

  • NTC 熱敏電阻:

  • 工作溫度:

    -40°C ~ 175°C(TJ)

  • 安裝類型:

    底座安裝

  • 封裝/外殼:

    模塊

  • 供應(yīng)商器件封裝:

    AG-HYBRIDD-1

  • 描述:

    IGBT MODULE 750V 950A

供應(yīng)商 型號 品牌 批號 封裝 庫存 備注 價格
Infineon(英飛凌)
23+
MODULE
8853
原廠可訂貨,技術(shù)支持,直接渠道。可簽保供合同
詢價
Infineon/英飛凌
21+
AG-HYBRIDD-1
6000
原裝現(xiàn)貨正品
詢價
INFINEON
23+
K-J
193
只有原裝,請來電咨詢
詢價
Infineon/英飛凌
23+
AG-HYBRIDD-1
25000
原裝正品,假一賠十!
詢價
Infineon(英飛凌)
21+
N/A
7524
全新原裝虧本出
詢價
Infineon(英飛凌)
23+
AG-HYBRIDD-1
19850
原裝正品,假一賠十
詢價
Infineon/英飛凌
23+
AG-HYBRIDD-1
12700
買原裝認準(zhǔn)中賽美
詢價
Infineon/英飛凌
23+
AG-HYBRIDD-1
25630
原裝正品
詢價
INFINEON/英飛凌
兩年內(nèi)
6000
原裝正品貨期兩周
詢價
Infineon/英飛凌
21+
AG-HYBRIDD-1
6820
只做原裝,質(zhì)量保證
詢價