零件編號 | 下載&訂購 | 功能描述 | 制造商&上傳企業(yè) | LOGO |
---|---|---|---|---|
SMD Type Green Emitter Features ?Topview1016package ?ViewingAngle=?600 ?Compatiblewithinfraredandvaporphasereflow solderprocess ?Highreliability ?UltrabrightGreen ?RoHScompliance ? Applications ?Opticalindicator. ?SwitchandSymbolDisplay. Description TheGC101606-ATC4 | CTMICRO CT Micro International Corporation | CTMICRO | ||
Rectifier Diode FEATURES *Halogen-freetype *Leadfreeproduct,compliancetoRoHS *GPRC(Glasspassivatedrectifierchip)inside *Glasspassivatedcavity-freejunction *Leadlesschipform,noleaddamage *Lowprofilepackage *Forsurfacemountedapplications *PlasticpackagehasUnderwritersLab | ZOWIEZowie Technology Corporation 智威智威科技股份有限公司 | ZOWIE | ||
Low VF Rectifier Diode FEATURES *Halogen-freetype *CompliancetoRoHSproduct *GPRC(Glasspassivatedrectifierchip)inside *Glasspassivatedcavity-freejunction *Leadlesschipform,noleaddamage *Lowforwardvoltagedrop *PlasticpackagehasUnderwritersLaboratoryFlammability Classification94 | ZOWIEZowie Technology Corporation 智威智威科技股份有限公司 | ZOWIE | ||
Rectifier Diode FEATURES *Halogen-freetype *Leadfreeproduct,compliancetoRoHS *GPRC(Glasspassivatedrectifierchip)inside *Glasspassivatedcavity-freejunction *Leadlesschipform,noleaddamage *Lowprofilepackage *Forsurfacemountedapplications *PlasticpackagehasUnderwritersLab | ZOWIEZowie Technology Corporation 智威智威科技股份有限公司 | ZOWIE | ||
Low VF Rectifier Diode FEATURES *Halogen-freetype *CompliancetoRoHSproduct *GPRC(Glasspassivatedrectifierchip)inside *Glasspassivatedcavity-freejunction *Leadlesschipform,noleaddamage *Lowforwardvoltagedrop *PlasticpackagehasUnderwritersLaboratoryFlammability Classification94 | ZOWIEZowie Technology Corporation 智威智威科技股份有限公司 | ZOWIE | ||
Rectifier Diode FEATURES *Halogen-freetype *Leadfreeproduct,compliancetoRoHS *GPRC(Glasspassivatedrectifierchip)inside *Glasspassivatedcavity-freejunction *Leadlesschipform,noleaddamage *Lowprofilepackage *Forsurfacemountedapplications *PlasticpackagehasUnderwritersLab | ZOWIEZowie Technology Corporation 智威智威科技股份有限公司 | ZOWIE | ||
Low VF Rectifier Diode FEATURES *Halogen-freetype *CompliancetoRoHSproduct *GPRC(Glasspassivatedrectifierchip)inside *Glasspassivatedcavity-freejunction *Leadlesschipform,noleaddamage *Lowforwardvoltagedrop *PlasticpackagehasUnderwritersLaboratoryFlammability Classification94 | ZOWIEZowie Technology Corporation 智威智威科技股份有限公司 | ZOWIE | ||
Rectifier Diode FEATURES *Halogen-freetype *Leadfreeproduct,compliancetoRoHS *GPRC(Glasspassivatedrectifierchip)inside *Glasspassivatedcavity-freejunction *Leadlesschipform,noleaddamage *Lowprofilepackage *Forsurfacemountedapplications *PlasticpackagehasUnderwritersLab | ZOWIEZowie Technology Corporation 智威智威科技股份有限公司 | ZOWIE | ||
Low VF Rectifier Diode FEATURES *Halogen-freetype *CompliancetoRoHSproduct *GPRC(Glasspassivatedrectifierchip)inside *Glasspassivatedcavity-freejunction *Leadlesschipform,noleaddamage *Lowforwardvoltagedrop *PlasticpackagehasUnderwritersLaboratoryFlammability Classification94 | ZOWIEZowie Technology Corporation 智威智威科技股份有限公司 | ZOWIE | ||
Rectifier Diode FEATURES *Halogen-freetype *Leadfreeproduct,compliancetoRoHS *GPRC(Glasspassivatedrectifierchip)inside *Glasspassivatedcavity-freejunction *Leadlesschipform,noleaddamage *Lowprofilepackage *Forsurfacemountedapplications *PlasticpackagehasUnderwritersLab | ZOWIEZowie Technology Corporation 智威智威科技股份有限公司 | ZOWIE | ||
Low VF Rectifier Diode FEATURES *Halogen-freetype *CompliancetoRoHSproduct *GPRC(Glasspassivatedrectifierchip)inside *Glasspassivatedcavity-freejunction *Leadlesschipform,noleaddamage *Lowforwardvoltagedrop *PlasticpackagehasUnderwritersLaboratoryFlammability Classification94 | ZOWIEZowie Technology Corporation 智威智威科技股份有限公司 | ZOWIE | ||
Silicon Carbide Schottky Diode FEATURES ·HighAvalanche(UIS)Capability ·LowThermalResistance ·ExtremelyFastSwitchingSpeeds APPLICATIONS ·BoostDiodeinPowerFactorCorrection(PFC) ·MotorDrives ·UninterruptiblePowerSupply(UPS) ·SwitchedModePowerSupply(SMPS) | ISCInchange Semiconductor Company Limited 無錫固電無錫固電半導(dǎo)體股份有限公司 | ISC | ||
ENHANCED PERFORMANCE SURFACE MOUNT EPSM PACKAGED DEVICES DESCRIPTION OurEPSMpackageddevicesaredesignedforthemostdemandingcommercialandMilitaryrequirementswheretheinconsistentperformanceinherentinplasticsurfacemountpackagescannotbetolerated.Thesepackagestylesextendthesurfacemountconstructionformatto6GHzforhighper | MicrosemiMicrosemi Corporation 美高森美美高森美公司 | Microsemi | ||
ENHANCED PERFORMANCE SURFACE MOUNT EPSM PACKAGED DEVICES DESCRIPTION OurEPSMpackageddevicesaredesignedforthemostdemandingcommercialandMilitaryrequirementswheretheinconsistentperformanceinherentinplasticsurfacemountpackagescannotbetolerated.Thesepackagestylesextendthesurfacemountconstructionformatto6GHzforhighper | MicrosemiMicrosemi Corporation 美高森美美高森美公司 | Microsemi | ||
ENHANCED PERFORMANCE SURFACE MOUNT EPSM PACKAGED DEVICES DESCRIPTION OurEPSMpackageddevicesaredesignedforthemostdemandingcommercialandMilitaryrequirementswheretheinconsistentperformanceinherentinplasticsurfacemountpackagescannotbetolerated.Thesepackagestylesextendthesurfacemountconstructionformatto6GHzforhighper | MicrosemiMicrosemi Corporation 美高森美美高森美公司 | Microsemi | ||
ENHANCED PERFORMANCE SURFACE MOUNT EPSM PACKAGED DEVICES DESCRIPTION OurEPSMpackageddevicesaredesignedforthemostdemandingcommercialandMilitaryrequirementswheretheinconsistentperformanceinherentinplasticsurfacemountpackagescannotbetolerated.Thesepackagestylesextendthesurfacemountconstructionformatto6GHzforhighper | MicrosemiMicrosemi Corporation 美高森美美高森美公司 | Microsemi | ||
ENHANCED PERFORMANCE SURFACE MOUNT EPSM PACKAGED DEVICES DESCRIPTION OurEPSMpackageddevicesaredesignedforthemostdemandingcommercialandMilitaryrequirementswheretheinconsistentperformanceinherentinplasticsurfacemountpackagescannotbetolerated.Thesepackagestylesextendthesurfacemountconstructionformatto6GHzforhighper | MicrosemiMicrosemi Corporation 美高森美美高森美公司 | Microsemi | ||
ENHANCED PERFORMANCE SURFACE MOUNT EPSM PACKAGED DEVICES DESCRIPTION OurEPSMpackageddevicesaredesignedforthemostdemandingcommercialandMilitaryrequirementswheretheinconsistentperformanceinherentinplasticsurfacemountpackagescannotbetolerated.Thesepackagestylesextendthesurfacemountconstructionformatto6GHzforhighper | MicrosemiMicrosemi Corporation 美高森美美高森美公司 | Microsemi | ||
ENHANCED PERFORMANCE SURFACE MOUNT EPSM PACKAGED DEVICES DESCRIPTION OurEPSMpackageddevicesaredesignedforthemostdemandingcommercialandMilitaryrequirementswheretheinconsistentperformanceinherentinplasticsurfacemountpackagescannotbetolerated.Thesepackagestylesextendthesurfacemountconstructionformatto6GHzforhighper | MicrosemiMicrosemi Corporation 美高森美美高森美公司 | Microsemi | ||
ENHANCED PERFORMANCE SURFACE MOUNT EPSM PACKAGED DEVICES DESCRIPTION OurEPSMpackageddevicesaredesignedforthemostdemandingcommercialandMilitaryrequirementswheretheinconsistentperformanceinherentinplasticsurfacemountpackagescannotbetolerated.Thesepackagestylesextendthesurfacemountconstructionformatto6GHzforhighper | MicrosemiMicrosemi Corporation 美高森美美高森美公司 | Microsemi |
供應(yīng)商 | 型號 | 品牌 | 批號 | 封裝 | 庫存 | 備注 | 價格 |
---|---|---|---|---|---|---|---|
G2 |
22+ |
PLCC20 |
2000 |
進(jìn)口原裝!現(xiàn)貨庫存 |
詢價 | ||
G2 |
2023+環(huán)?,F(xiàn)貨 |
QFP |
10 |
專注軍工、汽車、醫(yī)療、工業(yè)等方案配套一站式服務(wù) |
詢價 | ||
G |
05+ |
原廠原裝 |
4226 |
只做全新原裝真實現(xiàn)貨供應(yīng) |
詢價 | ||
HEAD |
23+ |
65480 |
詢價 | ||||
G2 |
24+ |
PLCC84 |
100000 |
原裝正品現(xiàn)貨 |
詢價 | ||
G2 |
23+ |
PLCC84 |
10880 |
原裝正品,支持實單 |
詢價 | ||
G2 |
23+ |
PLCC84 |
6000 |
專注配單,只做原裝進(jìn)口現(xiàn)貨 |
詢價 | ||
G2 |
23+ |
PLCC84 |
6000 |
專注配單,只做原裝進(jìn)口現(xiàn)貨 |
詢價 | ||
HEADLAND |
24+ |
PLCC |
2250 |
絕對原裝自家現(xiàn)貨!真實庫存!歡迎來電! |
詢價 | ||
23+ |
PLCC |
10000 |
原廠授權(quán)一級代理,專業(yè)海外優(yōu)勢訂貨,價格優(yōu)勢、品種 |
詢價 |
相關(guān)規(guī)格書
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相關(guān)庫存
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- GC11
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