首頁>GS881E32BGT-300>規(guī)格書詳情
GS881E32BGT-300中文資料GSI數(shù)據(jù)手冊PDF規(guī)格書
相關(guān)芯片規(guī)格書
更多- GS881E32BGT-200
- GS881E32BGD-300
- GS881E32BGD-300I
- GS881E32BGD-250I
- GS881E32BGD-333
- GS881E32BGT-200IV
- GS881E32BGD-250V
- GS881E32BGD-333I
- GS881E32BGD-200I
- GS881E32BGD-150I
- GS881E32BGT-150
- GS881E32BGT-150IV
- GS881E32BGD-200V
- GS881E32BGD-150IV
- GS881E32BD-333I
- GS881E32BGD-150V
- GS881E32BGD-250IV
- GS881E32BGT-200V
GS881E32BGT-300規(guī)格書詳情
Functional Description
Applications
The GS881E18B(T/D)/GS881E32B(D)/GS881E36B(T/D) is a 9,437,184-bit high performance synchronous SRAM with a 2-bit burst address counter. Although of a type originally developed for Level 2 Cache applications supporting high performance CPUs, the device now finds application in synchronous SRAM applications, ranging from DSP main store to networking chip set support.
Features
? FT pin for user-configurable flow through or pipeline operation
? Dual Cycle Deselect (DCD) operation
? IEEE 1149.1 JTAG-compatible Boundary Scan
? 2.5 V or 3.3 V +10/–10 core power supply
? 2.5 V or 3.3 V I/O supply
? LBO pin for Linear or Interleaved Burst mode
? Internal input resistors on mode pins allow floating mode pins
? Default to Interleaved Pipeline mode
? Byte Write (BW) and/or Global Write (GW) operation
? Internal self-timed write cycle
? Automatic power-down for portable applications
? JEDEC-standard 100-lead TQFP and 165-bump BGA packages
產(chǎn)品屬性
- 型號:
GS881E32BGT-300
- 制造商:
GSI
- 制造商全稱:
GSI Technology
- 功能描述:
512K x 18, 256K x 32, 256K x 36 9Mb Sync Burst SRAMs