首頁 >HEC0203BTRF-E>規(guī)格書列表
| 零件編號 | 下載&訂購 | 功能描述 | 制造商&上傳企業(yè) | LOGO |
|---|---|---|---|---|
SiliconPChannelMOSFETPowerSwitching | RENESASRenesas Technology Corp 瑞薩瑞薩科技有限公司 | RENESAS | ||
SiliconPChannelMOSFETPowerSwitching | RENESASRenesas Technology Corp 瑞薩瑞薩科技有限公司 | RENESAS | ||
SiliconPChannelMOSFETPowerSwitching | RENESASRenesas Technology Corp 瑞薩瑞薩科技有限公司 | RENESAS | ||
SiliconNChannelMOSFETPowerSwitching Features ?Lowon-resistance RDS(on)=68mΩtyp(VGS=4.5V,ID=1.5A) ?Lowdrivecurrent ?Highspeedswitching ?2.5Vgatedrive | RENESASRenesas Technology Corp 瑞薩瑞薩科技有限公司 | RENESAS | ||
SiliconNChannelMOSFETPowerSwitching Features ?Lowon-resistance RDS(on)=68mΩtyp(VGS=4.5V,ID=1.5A) ?Lowdrivecurrent ?Highspeedswitching ?2.5Vgatedrive | RENESASRenesas Technology Corp 瑞薩瑞薩科技有限公司 | RENESAS | ||
SiliconNChannelMOSFETPowerSwitching | RENESASRenesas Technology Corp 瑞薩瑞薩科技有限公司 | RENESAS | ||
CurrentTransducer | LEMLEM Electronics (China) Co., Ltd. 萊姆電子萊姆（LEM）集團(tuán) | LEM | ||
CurrentTransducer | LEMLEM Electronics (China) Co., Ltd. 萊姆電子萊姆（LEM）集團(tuán) | LEM | ||
SiliconSchottkyBarrierDiodeforRectifying | RENESASRenesas Technology Corp 瑞薩瑞薩科技有限公司 | RENESAS | ||
SiliconSchottkyBarrierDiodeforRectifying Features ?Lowforwardvoltagedropandsuitableforhigheffifiencyrectifying. ?UltrasmallFlatPackage(UFP)issuitableforsurfacemountdesign. | HitachiHitachi Semiconductor 日立日立公司 | Hitachi | ||
SiliconSchottkyBarrierDiodeforRectifying | RENESASRenesas Technology Corp 瑞薩瑞薩科技有限公司 | RENESAS | ||
SiliconSchottkyBarrierDiodeforRectifying Features ?Lowforwardvoltagedropandsuitableforhighefficiencyrectifying. ?UltrasmallFlatLeadPackage(UFP)issuitableforsurfacemountdesign | RENESASRenesas Technology Corp 瑞薩瑞薩科技有限公司 | RENESAS | ||
SiliconSchottkyBarrierDiodeforRectifying | RENESASRenesas Technology Corp 瑞薩瑞薩科技有限公司 | RENESAS | ||
SILICONSCHOTTKYBARRIERDIODEFORRECTIFYING | RENESASRenesas Technology Corp 瑞薩瑞薩科技有限公司 | RENESAS | ||
SiliconSchottkyBarrierDiodeforRectifying Features ?Lowforwardvoltagedropandsuitableforhighefficiencyrectifying. ?UltrasmallResinPackage(URP)issuitableforhighdensitysurfacemountingandhighspeedassembly. | RENESASRenesas Technology Corp 瑞薩瑞薩科技有限公司 | RENESAS | ||
SiliconSchottkyBarrierDiodeforRectifying Features ?Lowforwardvoltagedropandsuitableforhigheffifiencyrectifying. ?UltrasmallResinPackage(URP)issuitableforhighdensitysurfacemountingandhighspeedassembly. | HitachiHitachi Semiconductor 日立日立公司 | Hitachi | ||
SiliconSchottkyBarrierDiode | KEXINGuangdong Kexin Industrial Co.,Ltd 科信電子廣東科信實業(yè)有限公司 | KEXIN | ||
SiliconSchottkyBarrierDiodeforRectifying | RENESASRenesas Technology Corp 瑞薩瑞薩科技有限公司 | RENESAS | ||
SiliconSchottkyBarrierDiodeforRectifying Features ?Lowforwardvoltagedropandsuitableforhigheffifiencyrectifying. ?MPAKpackageissuitableforhighdensitysurfacemountingandhighspeedassembly. | HitachiHitachi Semiconductor 日立日立公司 | Hitachi | ||
SiliconSchottkyBarrierDiodeforRectifying Features ?Lowforwardvoltagedropandsuitableforhighefficiencyrectifying. ?MPAKpackageissuitableforhighdensitysurfacemountingandhighspeedassembly. | RENESASRenesas Technology Corp 瑞薩瑞薩科技有限公司 | RENESAS |
| 供應(yīng)商 | 型號 | 品牌 | 批號 | 封裝 | 庫存 | 備注 | 價格 |
|---|---|---|---|---|---|---|---|
RENESAS/瑞薩 |
22+ |
9800 |
只做原裝正品假一賠十!正規(guī)渠道訂貨! |
詢價 | |||
RENESAS/瑞薩 |
23+ |
6500 |
專注配單,只做原裝進(jìn)口現(xiàn)貨 |
詢價 | |||
RENESAS/瑞薩 |
23+ |
6500 |
專注配單,只做原裝進(jìn)口現(xiàn)貨 |
詢價 | |||
24+ |
MODULE |
2176 |
公司大量現(xiàn)貨 隨時可以發(fā)貨 |
詢價 | |||
LEM |
23+ |
原廠原裝 |
1005 |
全新原裝現(xiàn)貨 |
詢價 | ||
LEM |
24+ |
PCB |
5000 |
全現(xiàn)原裝公司現(xiàn)貨 |
詢價 | ||
LEM |
02+ |
PCB |
21 |
現(xiàn)貨 |
詢價 | ||
LEM |
23+ |
PCB |
15294 |
原廠授權(quán)一級代理,專業(yè)海外優(yōu)勢訂貨,價格優(yōu)勢、品種 |
詢價 | ||
LEM |
02+ |
PCB |
21 |
原裝現(xiàn)貨支持BOM配單服務(wù) |
詢價 | ||
HOSIDEN |
新 |
9800 |
全新原裝 貨期兩周 |
詢價 |
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