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HMESWF226

Cadre pivotant pour montage sur bati de 19 po

HAMMONDHammond Manufacturing Company Limited

哈蒙德哈蒙德制造有限公司

HMESWF226

PAINTED TEXTURED GRAY RAL 7035

HAMMONDHammond Manufacturing Company Limited

哈蒙德哈蒙德制造有限公司

HMESWF226

包裝:散裝 類別:盒子,外殼,機架 機架組件 描述:SWING FRAME FOR 19 MOUNTING

HAMMONDHammond Manufacturing Company Limited

哈蒙德哈蒙德制造有限公司

HMESWF226

包裝:盒 類別:盒子,外殼,機架 機架組件 描述:SWING FRAME FOR 19 MOUNTING

HAMMONDHammond Manufacturing Company Limited

哈蒙德哈蒙德制造有限公司

HSB226S

SiliconSchottkyBarrierDiode

SiliconSchottkyBarrierDiode Features ?Lowreversecurrent,Lowcapacitance. ?CMPAKPackageissuitableforhighdensitysurfacemountingandhighspeedassembly.

HitachiHitachi Semiconductor

日立日立公司

HSB226S

SiliconSchottkyBarrierDiodeforHighSpeedSwitching

SiliconSchottkyBarrierDiodeforHighSpeedSwitching Features ?Lowreversecurrent,Lowcapacitance. ?CMPAKpackageissuitableforhighdensitysurfacemountingandhighspeedassembly.

RENESASRenesas Technology Corp

瑞薩瑞薩科技有限公司

HSB226WK

SILICONSCHOTTKYBARRIERDIODE

Features ?Lowreversecurrent,Lowcapacitance. ?CMPAKPackageissuitableforhighdensitysurfacemountingandhighspeedassembly.

HitachiHitachi Semiconductor

日立日立公司

HSB226WK

SiliconSchottkyBarrierDiodeforHighSpeedSwitching

Features ?Lowreversecurrent,Lowcapacitance. ?CMPAKpackageissuitableforhighdensitysurfacemountingandhighspeedassembly.

RENESASRenesas Technology Corp

瑞薩瑞薩科技有限公司

HSB226YP

SiliconSchottkyBarrierDiodeforHighSpeedSwitching

Features ?Lowreversecurrent,Lowcapacitance. ?CMPAK-4Packageissuitableforhighdensitysurfacemountingandhighspeedassembly.

RENESASRenesas Technology Corp

瑞薩瑞薩科技有限公司

HSB226YP

SiliconSchottkyBarrierDiode

Features ?Lowreversecurrent,Lowcapacitance. ?CMPAK-4Packageissuitableforhighdensitysurfacemountingandhighspeedassembly.

HitachiHitachi Semiconductor

日立日立公司

HSBP226

14GAUGEGALVANIZEDSTEEL

HAMMONDHammond Manufacturing Company Limited

哈蒙德哈蒙德制造有限公司

HSBP226

Panneauxseparateursamontagelat?ral

HAMMONDHammond Manufacturing Company Limited

哈蒙德哈蒙德制造有限公司

HSC226

SiliconSchottkyBarrierDiode

Features ?Lowreversecurrent,Lowcapacitance. ?UltrasmallFlatPackage(UFP)issuitableforsurfacemountdesign.

HitachiHitachi Semiconductor

日立日立公司

HSC226

SiliconSchottkyBarrierDiodeforHighSpeedSwitching

Features ?Lowreversecurrent,Lowcapacitance. ?UltrasmallFlatLeadPackage(UFP)issuitableforsurfacemountdesign.

RENESASRenesas Technology Corp

瑞薩瑞薩科技有限公司

HSC226

SiliconSchottkyBarrierDiode

Features ?Lowreversecurrent,Lowcapacitance. ?UltrasmallFlatPackage(UFP)issuitableforsurfacemountdesign.

KEXINGuangdong Kexin Industrial Co.,Ltd

科信電子廣東科信實業(yè)有限公司

HSC226

SILICONSCHOTTKYBARRIERDIODE

Features ?Lowreversecurrent,lowcapacitance ?Ultrasmallflatpackageissuitableforsurfacemountdesign

SEMTECH_ELECSEMTECH ELECTRONICS LTD.

先之科半導(dǎo)體先之科半導(dǎo)體科技(東莞)有限公司

HSC226

LowForwardVoltageDrop,GuardRingConstrcitionForTransient

FEATURES LowForwardVoltageDrop. GuardRingConstructionForTransientProtection. NegligibleReverseRecoveryTime. LowReverseCapacitance. APPLICATIONS Schottybarrierswitching.

SKTECHNOLGYSHIKE Electronics

時科廣東時科微實業(yè)有限公司

HSD226

SiliconSchottkyBarrierDiodeforHighSpeedSwitching

RENESASRenesas Technology Corp

瑞薩瑞薩科技有限公司

HSIP226

Panneauxinterieursamontagelateral

HAMMONDHammond Manufacturing Company Limited

哈蒙德哈蒙德制造有限公司

HSIP226

14GAUGEGALVANIZEDSTEEL

HAMMONDHammond Manufacturing Company Limited

哈蒙德哈蒙德制造有限公司

產(chǎn)品屬性

  • 產(chǎn)品編號:

    HMESWF226

  • 制造商:

    Hammond Manufacturing

  • 類別:

    盒子,外殼,機架 > 機架組件

  • 系列:

    HMESWF

  • 包裝:

    散裝

  • 類型:

    轉(zhuǎn)向框

  • 大小 / 尺寸:

    82.362" 長 x 19.685" 寬 x 2.244" 高(2092.00mm x 500.00mm x 57.00mm)

  • 顏色:

    灰色

  • 材料:

    金屬 - 鋼

  • 配套使用/相關(guān)產(chǎn)品:

    HME 系列

  • 通風(fēng):

    非通風(fēng)

  • 描述:

    SWING FRAME FOR 19 MOUNTING

供應(yīng)商型號品牌批號封裝庫存備注價格
Hammond
2020+
N/A
155
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詢價
Hammond
22+
NA
155
加我QQ或微信咨詢更多詳細信息,
詢價
更多HMESWF226供應(yīng)商 更新時間2025-1-3 10:18:00