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HT2MOA3S20/E/1中文資料飛利浦數(shù)據(jù)手冊PDF規(guī)格書

HT2MOA3S20/E/1
廠商型號

HT2MOA3S20/E/1

功能描述

HITAGTM2 Chip Module

文件大小

161.3 Kbytes

頁面數(shù)量

22

生產(chǎn)廠商 NXP Semiconductors
企業(yè)簡稱

Philips飛利浦

中文名稱

荷蘭皇家飛利浦官網(wǎng)

原廠標識
數(shù)據(jù)手冊

下載地址一下載地址二到原廠下載

更新時間

2025-1-26 15:24:00

HT2MOA3S20/E/1規(guī)格書詳情

Definitions

Objective of the Specifications

This specification lists the parameters to be fulfilled by the HITAG 2 chip module HT2 MOA3 S20 for contactless smart cards or similar transponders (as e.g. discs).

Definition of the Chip Module

A chip module is an electronically packaged chip covered with a globe top cap. The HT2 MOA3 S20 is above all used as card module, i.e. for further lamination into contactless smart cards according to ISO 10536.1.

So the HITAG 2 chip module HT2 MOA3 S20 is best suited for customers that do not want to spend time with micro assembly and therefore start - e.g. ISO card production - with the HITAG 2 chip

Use of the Modules

The HITAG 2 modules are designed to be connected to a coil and then to be further processed by packaging into a transponder (e.g. lamination into an ISO smart card). Specific processing information for the coil-module connection and packaging is given in the specification.

For production of contactless chip cards it is recommended to prepunch card foils to create a recess for the chip module in the card body.

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