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HT2MOA3S20/E/1中文資料飛利浦數(shù)據(jù)手冊PDF規(guī)格書
HT2MOA3S20/E/1規(guī)格書詳情
Definitions
Objective of the Specifications
This specification lists the parameters to be fulfilled by the HITAG 2 chip module HT2 MOA3 S20 for contactless smart cards or similar transponders (as e.g. discs).
Definition of the Chip Module
A chip module is an electronically packaged chip covered with a globe top cap. The HT2 MOA3 S20 is above all used as card module, i.e. for further lamination into contactless smart cards according to ISO 10536.1.
So the HITAG 2 chip module HT2 MOA3 S20 is best suited for customers that do not want to spend time with micro assembly and therefore start - e.g. ISO card production - with the HITAG 2 chip
Use of the Modules
The HITAG 2 modules are designed to be connected to a coil and then to be further processed by packaging into a transponder (e.g. lamination into an ISO smart card). Specific processing information for the coil-module connection and packaging is given in the specification.
For production of contactless chip cards it is recommended to prepunch card foils to create a recess for the chip module in the card body.
供應商 | 型號 | 品牌 | 批號 | 封裝 | 庫存 | 備注 | 價格 |
---|---|---|---|---|---|---|---|
MINI |
24+ |
9000 |
原裝現(xiàn)貨假一賠十 |
詢價 | |||
MINI |
NA |
8600 |
原裝正品,歡迎來電咨詢! |
詢價 | |||
MINI |
三年內(nèi) |
1983 |
只做原裝正品 |
詢價 | |||
KAMCAP/凱美 |
2023 |
NA |
4280 |
原廠代理渠道,正品保障 |
詢價 | ||
NXP/恩智浦 |
2021+ |
SMD |
100500 |
一級代理專營品牌!原裝正品,優(yōu)勢現(xiàn)貨,長期排單到貨 |
詢價 | ||
MINI |
23+ |
6500 |
專注配單,只做原裝進口現(xiàn)貨 |
詢價 | |||
Mini-Circuits |
24+ |
1000 |
優(yōu)勢貨源原裝正品 |
詢價 | |||
MINI-CIRCUITS |
24+ |
con |
10000 |
查現(xiàn)貨到京北通宇商城 |
詢價 | ||
MINI |
24+ |
SMD |
3600 |
MINI專營品牌全新原裝正品假一賠十 |
詢價 | ||
ZETEX |
2023+ |
SOT-23 |
80000 |
一級代理/分銷渠道價格優(yōu)勢 十年芯程一路只做原裝正品 |
詢價 |