IRF9610S_V01中文資料威世科技數(shù)據(jù)手冊(cè)PDF規(guī)格書(shū)

FEATURES

? Surface-mount

? Available in tape and reel

? Dynamic dV/dt rating

? P-channel

? Fast switching

? Ease of paralleling

? Simple drive requirements

? Material categorization: for definitions of compliance

please see www.vishay.com/doc?99912

Note

* This datasheet provides information about parts that are

RoHS-compliant and / or parts that are non RoHS-compliant. For

example, parts with lead (Pb) terminations are not RoHS-compliant.

Please see the information / tables in this datasheet for details

DESCRIPTION

Third generation power MOSFETs from Vishay provide the

designer with the best combination of fast switching,

ruggedized device design, low on-resistance and

cost-effectiveness.

The D2PAK (TO-263) is a surface-mount power package

capable of accommodating die sizes up to HEX-4. It

provides the highest power capability and the lowest

possible on-resistance in any existing surface-mount

package. The D2PAK (TO-263) is suitable for high current

applications because of its low internal connection

resistance and can dissipate up to 2 W in a typical surface

mount application.