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IS61NLP25636A-200B3集成電路(IC)的存儲(chǔ)器規(guī)格書PDF中文資料

IS61NLP25636A-200B3
廠商型號(hào)

IS61NLP25636A-200B3

參數(shù)屬性

IS61NLP25636A-200B3 封裝/外殼為165-TBGA;包裝為托盤;類別為集成電路(IC)的存儲(chǔ)器;產(chǎn)品描述:IC SRAM 9MBIT PARALLEL 165TFBGA

功能描述

256K x 36 and 512K x 18 9Mb, PIPELINE (NO WAIT) STATE BUS SRAM

封裝外殼

165-TBGA

文件大小

261.57 Kbytes

頁面數(shù)量

37

生產(chǎn)廠商 Integrated Silicon Solution Inc
企業(yè)簡(jiǎn)稱

ISSI北京矽成

中文名稱

北京矽成半導(dǎo)體有限公司官網(wǎng)

原廠標(biāo)識(shí)
數(shù)據(jù)手冊(cè)

下載地址一下載地址二

更新時(shí)間

2025-3-1 16:54:00

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IS61NLP25636A-200B3規(guī)格書詳情

DESCRIPTION

The 9 Meg NLP/NVP product family feature high-speed, low-power synchronous static RAMs designed to provide a burstable, high-performance, no wait state, device for networking and communications applications. They are organized as 256K words by 36 bits and 512K words by 18 bits, fabricated with ISSIs advanced CMOS technology.

FEATURES

? 100 percent bus utilization

? No wait cycles between Read and Write

? Internal self-timed write cycle

? Individual Byte Write Control

? Single R/W (Read/Write) control pin

? Clock controlled, registered address, data and control

? Interleaved or linear burst sequence control using MODE input

? Three chip enables for simple depth expansion and address pipelining

? Power Down mode

? Common data inputs and data outputs

? CKE pin to enable clock and suspend operation

? JEDEC 100-pin TQFP, 165-ball PBGA and 119- ball PBGA packages

? Power supply:

NVP: VDD 2.5V (± 5), VDDQ 2.5V (± 5)

NLP: VDD 3.3V (± 5), VDDQ 3.3V/2.5V (± 5)

? JTAG Boundary Scan for PBGA packages

? Industrial temperature available

? Lead-free available

產(chǎn)品屬性

  • 產(chǎn)品編號(hào):

    IS61NLP25636A-200B3I-TR

  • 制造商:

    ISSI, Integrated Silicon Solution Inc

  • 類別:

    集成電路(IC) > 存儲(chǔ)器

  • 包裝:

    托盤

  • 存儲(chǔ)器類型:

    易失

  • 存儲(chǔ)器格式:

    SRAM

  • 技術(shù):

    SRAM - 同步,SDR

  • 存儲(chǔ)容量:

    9Mb(256K x 36)

  • 存儲(chǔ)器接口:

    并聯(lián)

  • 電壓 - 供電:

    3.135V ~ 3.465V

  • 工作溫度:

    -40°C ~ 85°C(TA)

  • 安裝類型:

    表面貼裝型

  • 封裝/外殼:

    165-TBGA

  • 供應(yīng)商器件封裝:

    165-TFBGA(13x15)

  • 描述:

    IC SRAM 9MBIT PARALLEL 165TFBGA

供應(yīng)商 型號(hào) 品牌 批號(hào) 封裝 庫存 備注 價(jià)格
ISSI(美國芯成)
1921+
TFBGA-165(13x15)
3575
向鴻倉庫現(xiàn)貨,優(yōu)勢(shì)絕對(duì)的原裝!
詢價(jià)
ISSI
2020+
BGA
650
原裝現(xiàn)貨,優(yōu)勢(shì)渠道訂貨假一賠十
詢價(jià)
ISSI
23+
165-PBGA(13x15)
39257
專業(yè)分銷產(chǎn)品!原裝正品!價(jià)格優(yōu)勢(shì)!
詢價(jià)
ISSI,
21+
25000
原廠原包 深圳現(xiàn)貨 主打品牌 假一賠百 可開票!
詢價(jià)
ISSI
23+
存儲(chǔ)器
5864
原裝原標(biāo)原盒 給價(jià)就出 全網(wǎng)最低
詢價(jià)
ISSI, Integrated Silicon Solut
21+
54-VFBGA
5280
進(jìn)口原裝!長(zhǎng)期供應(yīng)!絕對(duì)優(yōu)勢(shì)價(jià)格(誠信經(jīng)營
詢價(jià)
ISSI Integrated Silicon Soluti
23+/24+
165-TBGA
8600
只供原裝進(jìn)口公司現(xiàn)貨+可訂貨
詢價(jià)
ISSI(美國芯成)
2447
TFBGA-165(13x15)
315000
144個(gè)/托盤一級(jí)代理專營品牌!原裝正品,優(yōu)勢(shì)現(xiàn)貨,長(zhǎng)
詢價(jià)
ISSI(美國芯成)
2022+原裝正品
TFBGA-165(13x15)
18000
支持工廠BOM表配單 公司只做原裝正品貨
詢價(jià)
ISSI, Integrated Silicon Solu
23+
165-TFBGA13x15
7300
專注配單,只做原裝進(jìn)口現(xiàn)貨
詢價(jià)