1 Features

? AEC-Q100 qualified with:

– Temperature grade 0: –40°C to 150°C Ambient

Operating Temperature Range

– Device HBM ESD classification level 2

– Device CDM ESD classification level C5

? Robust integrated isolation barrier:

– Withstand isolation voltage: 3000 VRMS

– Isolation working voltage: 500 VRMS

? Isolation barrier life: > 50 years

? Temperature sensor accuracy

– ±0.5°C typical at 25°C

– ±1.5°C maximum from 0°C to 70°C

– ±2.0°C maximum from –40°C to +150°C

? Operating supply range: 2.3 V to 5.5 V

? Positive slope sensor gain: 10 mV/°C, with 500 mV

offset at 0°C

? Fast thermal response: < 2 seconds

? Short circuit protected output

? Low power consumption: 9 μA (typical)

? DFQ (SOIC-7) package

? Safety-related certifications (planned):

– 3-kVRMS isolation for 1 minute per UL 1577

2 Applications

? Silicon Carbide (SiC) PowerFET temperature

monitoring

? Insulated-Gate Bipolar Transistor (IGBT)

PowerFET temperature monitoring

? HEV/EV battery-management system (BMS)

? HEV/EV on-board charger (OBC) & wireless

charger

? HEV/EV DC/DC converter

? HEV/EV inverter & motor control

? Powertrain temperature sensor

3 Description

The ISOTMP35-Q1 is the industry’s first isolated

temperature sensor IC, combining an integrated

isolation barrier, up to 3000 VRMS withstand voltage,

with an analog temperature sensor featuring a 10

mV/°C slope from –40°C to +150°C. This integration

enables the sensor to be co-located with high voltage

heat source (for example: HV FETs, IGBTs, or

HV contactors) without requiring expensive isolation

circuitry. The direct contact with the high-voltage heat

source also provides greater accuracy and faster

thermal response compared approaches where the

sensor is placed further away to meet isolation

requirements.

Operating from a non-isolated 2.3-V to 5.5-V

supply, the ISOTMP35-Q1 allows easy integration

into applications where sub-regulated power is not

available on the high-voltage plane.

The integrated isolation barrier satisfies UL 1577

requirements. The surface mount package (7-pin

SOIC) provides excellent heat flow from the heat

source to the embedded thermal sensor, minimizing

thermal mass and providing more accurate heatsource

measurement. This reduces the need for timeconsuming

thermal modeling and improves system

design margin by reducing mechanical variations due

to manufacturing and assembly.

The ISOTMP35-Q1 class-AB output driver provides

a strong 500-μA maximum output to drive capacitive

loads up to 1000 pF and is designed to directly

interface with analog-to-digital converter (ADC)

sample and hold inputs.