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零件編號 | 下載&訂購 | 功能描述 | 制造商&上傳企業(yè) | LOGO |
---|---|---|---|---|
SILICONMONOLITHICCMOSDIGITALINTEGRATEDCIRCUIT(SCHMITTINVERTER) | KECKEC CORPORATION KEC株式會社 | KEC | ||
10mmADJUSTABLERFCOILS(UNSHIELDED) | FRONTIER Frontier Electronics | FRONTIER | ||
10mmAdjustableUnshieldedIFTCoils | FRONTIER Frontier Electronics | FRONTIER | ||
10mmAdjustableUnshieldedIFTCoils | FRONTIER Frontier Electronics | FRONTIER | ||
Photocoupler(ThesePhotocouplersconsistoftwoGalliumArsenideInfraredEmitting) | KODENSHIKODENSHI_AUK CORP. 可天士可天士光電子集團 | KODENSHI | ||
Photocoupler(ThesePhotocouplersconsistoftwoGalliumArsenideInfraredEmitting) | KODENSHIKODENSHI_AUK CORP. 可天士可天士光電子集團 | KODENSHI | ||
Opticreceivermodules | KODENSHIKODENSHI_AUK CORP. 可天士可天士光電子集團 | KODENSHI | ||
Opticreceivermodules | KODENSHIKODENSHI_AUK CORP. 可天士可天士光電子集團 | KODENSHI | ||
WideInput,7.5WSMTSingle&DualOutputDC/DCConverters | MPD MPD (Memory Protection Devices) | MPD | ||
Siliconepitaxialplanartype Siliconepitaxialplanartype Forswitchingcircuits Forwavedetectioncircuit ■Features ?TwoMA3X704Asarecontainedinonepackage(Twodiodesinadifferentdirection) ?Optimumforlow-voltagerectificationbecauseofitslowforwardrisevoltage(VF) ?Optimumforhigh-frequencyrect | PanasonicPanasonic Semiconductor 松下松下電器 | Panasonic | ||
Battey-PowerdSupplySystems | MaximMaxim Integrated Products 美信美信半導體 | Maxim | ||
Battey-PowerdSupplySystems | MaximMaxim Integrated Products 美信美信半導體 | Maxim | ||
Battey-PowerdSupplySystems | MaximMaxim Integrated Products 美信美信半導體 | Maxim | ||
Battey-PowerdSupplySystems | MaximMaxim Integrated Products 美信美信半導體 | Maxim | ||
Battey-PowerdSupplySystems | MaximMaxim Integrated Products 美信美信半導體 | Maxim | ||
Battey-PowerdSupplySystems | MaximMaxim Integrated Products 美信美信半導體 | Maxim | ||
Battey-PowerdSupplySystems | MaximMaxim Integrated Products 美信美信半導體 | Maxim | ||
TypeMGPrecisionHighVoltageResistors | Caddock Caddock Electronics, Inc. | Caddock | ||
PrecisionHighVoltageResistors | etc2List of Unclassifed Manufacturers etc未分類制造商etc2未分類制造商 | etc2 | ||
3WATTGLASSZENERDIODES FEATURES ●Microminiaturepackage. ●Voidlesshermeticallysealedglasspackage. ●Triplelayerpassivation. ●Metallurgicallybonded. ●Highperformancecharacteristics. ●Stableoperationattemperatureto200°C ●Verylowthermalimpedance. | MicrosemiMicrosemi Corporation 美高森美美高森美公司 | Microsemi |
供應商 | 型號 | 品牌 | 批號 | 封裝 | 庫存 | 備注 | 價格 |
---|---|---|---|---|---|---|---|
A |
24+ |
b |
53 |
詢價 | |||
SEC |
2022+ |
37 |
全新原裝 貨期兩周 |
詢價 | |||
SAMSUNG |
23+ |
DIP |
9562 |
詢價 | |||
SMG |
05+ |
原廠原裝 |
222 |
只做全新原裝真實現(xiàn)貨供應 |
詢價 | ||
23+ |
DIP |
8890 |
價格優(yōu)勢/原裝現(xiàn)貨/客戶至上/歡迎廣大客戶來電查詢 |
詢價 | |||
SAMSANG |
19+ |
DIP |
256800 |
原廠代理渠道,每一顆芯片都可追溯原廠; |
詢價 | ||
KEC |
6000 |
面議 |
19 |
DIP/SMD |
詢價 | ||
SAMSUNG |
24+ |
DIP |
16800 |
絕對原裝進口現(xiàn)貨,假一賠十,價格優(yōu)勢!? |
詢價 | ||
SAMSUNG/三星 |
21+ |
DIP |
10000 |
原裝現(xiàn)貨假一罰十 |
詢價 | ||
NA |
24+ |
150 |
原裝現(xiàn)貨假一賠十 |
詢價 |
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