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KTE7000中文資料芯凱電子數(shù)據(jù)手冊PDF規(guī)格書

KTE7000
廠商型號

KTE7000

功能描述

5W Wireless Power Receiver for WPC/Qi BPP

文件大小

207.3 Kbytes

頁面數(shù)量

2

生產(chǎn)廠商 Kinetic Technologies.
企業(yè)簡稱

KINETIC芯凱電子

中文名稱

芯凱電子科技(上海)有限公司官網(wǎng)

原廠標(biāo)識
數(shù)據(jù)手冊

下載地址一下載地址二到原廠下載

更新時(shí)間

2025-2-24 9:30:00

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KTE7000規(guī)格書詳情

Features

? Single-Chip Solution for 5Watt wireless power

? WPC/Qi v1.3 Standards Compliant

? 97% Peak Efficiency from Coil to 5VOUT in LDO mode

? Full Synchronous Rectification with Low-RDSON

? 5V LDO Mode or Pass-Through Mode configurable

? Up to 1.5A peak output current

? Pass-Through Mode for increased efficiency

? Short-circuit protection and current limiting

? Embedded Microcontroller and OTP Memory

? Configurable Foreign Object Detection (FOD)

? Standard Firmware with optional external resistor

configuration of FOD operating parameters

? Optional I2C connection for monitoring/configuration

and system performance analysis

? Device Enable control pin for extremely low power

consumption while in disabled mode

? Optional open-drain Interrupt output pin

? Proprietary, robust internal Over-Voltage Protection

? Without any external “Sink” resistor or other devices

? Optional external NTC Over-Temperature Protection

? -40°C to 85°C operating temperature range

? 52-bump WLCSP 2.66 x 3.90mm (0.4mm pitch)

Brief Description

The KTE7000 is a single-chip 5Watt wireless power

receiver that conforms to WPC/Qi standards v1.3

Baseline Power Profile (BPP) specifications. A wireless

power receiver provides regulated DC output power

derived from AC power that is magnetically coupled into

a connected wireless power receiver coil.

The KTE7000 integrates a full-synchronous rectifier and

an LDO to efficiently convert the wireless AC power into

5V DC output power at up to 1.5A. An embedded

microcontroller with ROM and OTP memory provides

power management, protection, and communications

with the power transmitter.

The KTE7000 is packaged in an advanced, fully “green”

compliant, 2.66mm x 3.90mm, 52-bump Wafer-Level

Chip-Scale Package (6x9 WLCSP).

Applications

? Mobile Internet Devices, IoT, Accessories

? Battery Powered Medical, Industrial, Consumer

? Wireless Headsets, Headphones, Earbuds

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