LGA670中文資料艾邁斯歐司朗數(shù)據(jù)手冊PDF規(guī)格書

SIDELED?

Features

? package:white SMT package, colorless clear resin

? feature of the device:radiation direction parallel to PCB, so an ideal LED for coupling in light guides

? wavelength:628 nm (super-red),

606 nm (orange), 587 nm (yellow),

570 nm (green), 560 nm (pure green)

? viewing angle:Lambertian Emitter (120°)

? technology:GaAsP (super-red, orange, yellow, green), GaP (pure green)

? optical efficiency:1.5 lm/W (super-red, orange, yellow), 2.5 lm/W (green), 0.6 lm/W (pure green)

? grouping parameter:luminous intensity, wavelength

? assembly methods:suitable for all SMT assembly methods

? soldering methods:IR reflow soldering and TTW soldering

? preconditioning:acc. to JEDEC Level 2

? taping:12 mm tape with 2000/reel, ?330 mm

Applications

? optical indicator

? backlighting (LCD, cellular phones, switches, keys, displays, illuminated advertising, general lighting)

? coupling into light guides

? signal and symbol luminaire

? interior automotive lighting (e.g. dashboard backlighting, etc.)

? marker lights (e.g. steps, exit ways, etc.)