LMV324AQPWRQ1中文資料德州儀器數(shù)據(jù)手冊(cè)PDF規(guī)格書

1 Features

? AEC-Q100 qualified for automotive applications

– Temperature grade 1: –40°C to +125°C, TA

– Device HBM ESD classification level 2

– Device CDM ESD classification level C6

? Low input offset voltage: ±1 mV

? Rail-to-rail output

? Unity-gain bandwidth: 1 MHz

? Low broadband noise: 30 nV/√ Hz

? Low input bias current: 10 pA

? Low quiescent current: 70 μA/Ch

? Unity-gain stable

? Internal RFI and EMI filter

? Operational at supply voltages as low as 2.5 V

? Easier to stabilize with higher capacitive load due

to resistive open-loop output impedance

? Extended temperature range: –40°C to 125°C

2 Applications

? Optimized for AEC-Q100 grade 1 applications

? Infotainment and cluster

? Passive safety

? Body electronics and lighting

? HEV/EV inverter and motor control

? On-board (OBC) and wireless charger

? Powertrain current sensor

? Advanced driver assistance systems (ADAS)

? Single-supply, low-side, unidirectional currentsensing

circuit

3 Description

The LMV3xxA-Q1 family includes single (LMV321AQ1),

dual (LMV358A-Q1), and quad-channel

(LMV324A-Q1) low-voltage (2.5 V to 5.5 V)

automotive operational amplifiers (op amps) with

rail-to-rail output swing capabilities. These op amps

provide a cost-effective method for space-constrained

applications such as infotainment and lighting where

low-voltage operation and high capacitive-load drive

are required. The capacitive-load drive of the

LMV3xxA-Q1 family is 500 pF, and the resistive openloop

output impedance makes stabilization easier with

much higher capacitive loads. These op amps are

designed specifically for low-voltage operation (2.5 V

to 5.5 V) with performance specifications similar to the

LMV3xx-Q1 devices.

The robust design of the LMV3xxA-Q1 family

simplifies circuit design. The op amps feature unitygain

stability, an integrated RFI and EMI rejection

filter, and no-phase reversal in overdrive conditions.

The LMV3xxA-Q1 family is available in industrystandard

packages such as SOIC, MSOP, SOT-23,

and TSSOP packages.