零件編號(hào) | 下載&訂購(gòu) | 功能描述 | 制造商&上傳企業(yè) | LOGO |
---|---|---|---|---|
AMCCSeriesCutCoreFINEMET?F3CCSeriesCutCore | ETCList of Unclassifed Manufacturers 未分類制造商 | ETC | ||
SMDSchottkyBarrierDiode Features IO=350mA VR=20Vto40V -Lowforwardvoltage -Designedformountingonsmallsurface. -Extremelythinpackage. -Majoritycarrierconduction. -Lead-freedevice MechanicalData -Case:0603(1608)1005(2512)standardpackage,moldedplastic. -Terminals:Goldplated | ANACHIPAnachip Corp 易亨電子易亨電子股份有限公司 | ANACHIP | ||
SMDSchottkyBarrierDiode Features IO=350mA VR=20Vto40V -Lowforwardvoltage -Designedformountingonsmallsurface. -Extremelythinpackage. -Majoritycarrierconduction. -Lead-freedevice MechanicalData -Case:0603(1608)1005(2512)standardpackage,moldedplastic. -Terminals:Goldplated | ANACHIPAnachip Corp 易亨電子易亨電子股份有限公司 | ANACHIP | ||
SMDSchottkyBarrierDiode Features IO=350mA VR=20Vto40V -Lowforwardvoltage -Designedformountingonsmallsurface. -Extremelythinpackage. -Majoritycarrierconduction. -Lead-freedevice MechanicalData -Case:0603(1608)1005(2512)standardpackage,moldedplastic. -Terminals:Goldplated | ANACHIPAnachip Corp 易亨電子易亨電子股份有限公司 | ANACHIP | ||
Highreliabilitytomechanicalstress | ABRACON Abracon Corporation | ABRACON | ||
Single-EndedCordsets Basicfeatures Approval/ConformityCE cULus EAC WEEE | BalluffBalluff Korea Ltd. 巴魯夫巴魯夫集團(tuán) | Balluff | ||
SMDSchottkyBarrierDiode IO=350mA VR=20to40Volts Features Lowforwardvoltage. Designedformountingonsmallsurface. Extremelythin/leadlesspackage. Majoritycarrierconduction. Mechanicaldata Case:1005(2512)standardpackage, moldedplastic. Terminals:Gold | COMCHIPComchip Technology 典琦典琦科技股份有限公司 | COMCHIP | ||
SMDSchottkyBarrierDiode IO=350mA VR=20to40Volts Features Halogenfree. Lowforwardvoltage. Designedformountingonsmallsurface. Extremelythin/leadlesspackage. Majoritycarrierconduction. Mechanicaldata Case:1005(2512)standardpackage,moldedplastic. Terminals:Goldplat | COMCHIPComchip Technology 典琦典琦科技股份有限公司 | COMCHIP | ||
SMDSchottkyBarrierDiode IO=350mA VR=20to40Volts Features Lowforwardvoltage. Designedformountingonsmallsurface. Extremelythin/leadlesspackage. Majoritycarrierconduction. Mechanicaldata Case:1005(2512)standardpackage, moldedplastic. Terminals:Gol | COMCHIPComchip Technology 典琦典琦科技股份有限公司 | COMCHIP | ||
SMDSchottkyBarrierDiode Io=350mA VR=20to40Volts RoHSDevice HalogenFree Features -Lowforwardvoltage. -Designedformountingonsmallsurface. -Extremelythin/leadlesspackage. -Majoritycarrierconduction. Mechanicaldata -Case:1005/SOD-323Fstandardpackage, moldedplastic. -Terminals: | COMCHIPComchip Technology 典琦典琦科技股份有限公司 | COMCHIP | ||
SMDSchottkyBarrierDiode IO=350mA VR=20to40Volts Features Lowforwardvoltage. Designedformountingonsmallsurface. Extremelythin/leadlesspackage. Majoritycarrierconduction. Mechanicaldata Case:0603(1608)standardpackage, moldedplastic. Terminals:Gol | COMCHIPComchip Technology 典琦典琦科技股份有限公司 | COMCHIP | ||
SMDSchottkyBarrierDiode | COMCHIPComchip Technology 典琦典琦科技股份有限公司 | COMCHIP | ||
SMDSchottkyBarrierDiode Io=350mA VR=20to40Volts RoHSDevice HalogenFree Features -Lowforwardvoltage. -Designedformountingonsmallsurface. -Extremelythin/leadlesspackage. -Majoritycarrierconduction. Mechanicaldata -Case:0603/SOD-523Fstandardpackage,moldedplastic. -Terminals:Gol | COMCHIPComchip Technology 典琦典琦科技股份有限公司 | COMCHIP | ||
SMDSchottkyBarrierDiode IO=350mA VR=20to40Volts Features Lowforwardvoltage. Designedformountingonsmallsurface. Extremelythin/leadlesspackage. Majoritycarrierconduction. Mechanicaldata Case:0603(1608)standardpackage, moldedplastic. Terminals:Gold | COMCHIPComchip Technology 典琦典琦科技股份有限公司 | COMCHIP | ||
SMDSchottkyBarrierDiode Io=350mA VR=20to40Volts RoHSDevice HalogenFree Features -Lowforwardvoltage. -Designedformountingonsmallsurface. -Extremelythin/leadlesspackage. -Majoritycarrierconduction. Mechanicaldata -Case:0603/SOD-523Fstandardpackage,moldedplastic. -Terminals:Gol | COMCHIPComchip Technology 典琦典琦科技股份有限公司 | COMCHIP | ||
DC-ACINVERTERUNIT5WDUALOUTPUTSWITHDIMMINGFUNCTION | POWER-SYSTEMS Power Systems GmbH+Co.KG | POWER-SYSTEMS | ||
Dimming/ConnectorType | TDKTDK Corporation TDK株式會(huì)社東電化(中國(guó))投資有限公司 | TDK | ||
0.3AmpSiliconControlledRectifiersVOID-FREEGLASSPASSIVATEDCHIPS | FCIFirst Components International 戈采戈采企業(yè)股份有限公司 | FCI | ||
0.3AmpSiliconControlledRectifiersMechanicalDimensions | FCIFirst Components International 戈采戈采企業(yè)股份有限公司 | FCI | ||
EMI/EMCFILTER Features -Ideallysuitedforproductsthatmustconformtopart 15,FCCregulations -Metalcasedminiaturetypewithhighperformance -MeetovervoltagecategoryIlof[EC60664andcomply withIEC60950 -UsesIECconnectorthatmeetsthesafetystandards fromcertificationbodies -So | DIT DONG IL TECHNOLOGY LTD. | DIT |
詳細(xì)參數(shù)
- 型號(hào):
LSGP0320
- 制造商:
Panasonic Industrial Company
- 功能描述:
SCREEN
供應(yīng)商 | 型號(hào) | 品牌 | 批號(hào) | 封裝 | 庫(kù)存 | 備注 | 價(jià)格 |
---|---|---|---|---|---|---|---|
ST/意法 |
23+ |
SOP14 |
6000 |
一級(jí)代理原廠VIP渠道,專注軍工、汽車、醫(yī)療、工業(yè)、 |
詢價(jià) | ||
龍騰 |
TOLL |
21000 |
全新、原裝 |
詢價(jià) | |||
龍騰半導(dǎo)體 |
23+ |
DFN5×6 |
4500 |
專營(yíng)國(guó)產(chǎn)功率器件 |
詢價(jià) | ||
OSRAM |
23+ |
NA |
5000 |
全新原裝假一賠十 |
詢價(jià) | ||
1210 |
23+ |
NA |
15659 |
振宏微專業(yè)只做正品,假一罰百! |
詢價(jià) | ||
原裝OSRAM |
2023+ |
1210 |
80000 |
一級(jí)代理/分銷渠道價(jià)格優(yōu)勢(shì) 十年芯程一路只做原裝正品 |
詢價(jià) | ||
N/A |
2021+ |
SMD |
100500 |
一級(jí)代理專營(yíng)品牌!原裝正品,優(yōu)勢(shì)現(xiàn)貨,長(zhǎng)期排單到貨 |
詢價(jià) | ||
OSRAM |
23+ |
SMD |
50000 |
全新原裝正品現(xiàn)貨,支持訂貨 |
詢價(jià) | ||
OSRAM |
23+ |
SMD |
3200 |
全新原裝、誠(chéng)信經(jīng)營(yíng)、公司現(xiàn)貨銷售! |
詢價(jià) | ||
osram |
24+ |
500000 |
行業(yè)低價(jià),代理渠道 |
詢價(jià) |
相關(guān)規(guī)格書(shū)
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相關(guān)庫(kù)存
更多- LSGP0365
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