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M705-GRN360-MZ中文資料ETC數(shù)據(jù)手冊(cè)PDF規(guī)格書

M705-GRN360-MZ
廠商型號(hào)

M705-GRN360-MZ

功能描述

High-Reliability, High-Preheat Resistance Lead-Free Solder Paste

文件大小

835.74 Kbytes

頁(yè)面數(shù)量

12 頁(yè)

生產(chǎn)廠商 List of Unclassifed Manufacturers
企業(yè)簡(jiǎn)稱

ETC

中文名稱

未分類制造商

原廠標(biāo)識(shí)
數(shù)據(jù)手冊(cè)

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更新時(shí)間

2025-2-9 13:58:00

M705-GRN360-MZ規(guī)格書詳情

M705-GRN360-MZ is eco-friendly solder paste that provides cream solder with high-temperature preheat resistance while maintaining the high printability of our former paste, GRN360-L60. This new paste mitigates problems involving defective solder fusion between solder balls and paste that have been experiencedwhen BGA/CSP devices are mounted. The use of BGA/CSP devices has recently been expanding, mainly in digital products.

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