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M705-GRN360-MZ中文資料ETC數(shù)據(jù)手冊PDF規(guī)格書
M705-GRN360-MZ規(guī)格書詳情
M705-GRN360-MZ is eco-friendly solder paste that provides cream solder with high-temperature preheat resistance while maintaining the high printability of our former paste, GRN360-L60. This new paste mitigates problems involving defective solder fusion between solder balls and paste that have been experiencedwhen BGA/CSP devices are mounted. The use of BGA/CSP devices has recently been expanding, mainly in digital products.
| 供應(yīng)商 | 型號 | 品牌 | 批號 | 封裝 | 庫存 | 備注 | 價格 |
|---|---|---|---|---|---|---|---|
MREL/麥瑞 |
23+ |
NA/ |
4030 |
原裝現(xiàn)貨,當(dāng)天可交貨,原型號開票 |
詢價 | ||
XFCN(臺灣興飛) |
22+ |
連接器 |
123000 |
主打連接器供應(yīng),現(xiàn)貨庫存 |
詢價 | ||
PERSEMI |
23+ |
DIP |
13000 |
原廠授權(quán)一級代理,專業(yè)海外優(yōu)勢訂貨,價格優(yōu)勢、品種 |
詢價 | ||
YJ |
22+ |
DO-214 |
354000 |
詢價 | |||
MICROCHIP/微芯 |
24+ |
8SOIC |
7671 |
原裝正品.優(yōu)勢專營 |
詢價 | ||
XFCN(臺灣興飛) |
21+ |
P=3.96mm |
4750 |
中國航天工業(yè)部戰(zhàn)略合作伙伴行業(yè)領(lǐng)導(dǎo)者 |
詢價 | ||
MITSLMI/\\ |
10+ |
TSSOP16 |
6000 |
絕對原裝自己現(xiàn)貨 |
詢價 | ||
YJ |
24+ |
DO-214 |
15000 |
原裝現(xiàn)貨假一賠十 |
詢價 | ||
ST |
23+ |
DIP |
16900 |
正規(guī)渠道,只有原裝! |
詢價 | ||
MICREL/麥瑞 |
24+23+ |
SOP |
12580 |
16年現(xiàn)貨庫存供應(yīng)商終端BOM表可配單提供樣品 |
詢價 |
