MAX6023EBT30-T中文資料美信數(shù)據(jù)手冊PDF規(guī)格書

General Description

The MAX6023 is a family of low-dropout, micropower voltage references in a 5-bump, chip-scale package (UCSP?). The MAX6023 series-mode (three-terminal) references, which operate with input voltages from 2.5V to 12.6V (1.25V and 2.048V options) or (VOUT + 0.2V) to 12.6V (all other voltage options), are available with output voltage options of 1.25V, 2.048V, 2.5V, 3.0V, 4.096V, 4.5V, and 5.0V. These devices are guaranteed an initial accuracy of ±0.2 and 30ppm/°C temperature drift over the -40°C to +85°C extended temperature range.

UCSPs offer the benefit of moving to smaller footprint and lower profile devices, significantly smaller than even SC70 or SOT23 plastic surface-mount packages. The significantly lower profile (compared to plastic SMD packages) of the UCSP makes the device ideal for height-critical applications. Miniature UCSP packages also enable device placement close to sources and allow more flexibility in a complex or large design layout.

Features

? 5-Bump UCSP Package (1.0mm ? 1.5mm ? 0.3mm)

? No Output Capacitor Needed

? ±0.2 (max) Initial Accuracy

? 30ppm/°C (max) Temperature Coefficient

? 35μA (max) Quiescent Supply Current

? 0.8μA/V (max) Supply Current Variation with VIN

? 100mV Dropout at 500μA Load Current

? Line Regulation: 160μV/V (max)

? Output Voltage Options: 1.25V, 2.048V, 2.5V, 3.0V,

?? 4.096V, 4.5V, 5.0V

Applications

?? Hand-Held Equipment

?? Data Acquisition Systems

?? Industrial and Process Control Systems

?? Battery-Operated Equipment

?? Hard-Disk Drives