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MBF

SINGLE PHASE GLASS PASSIVATED BRIDGE RECTIFIERS

FEATURES ?Idealforprintedcircuitboard ?Reliablelowcostconstructionutilizingmoldedplastictechnique ?Hightemperaturesolderingguaranteed:260*/10secondsat5lbs.,(2.3kg)tension ?Smallsize,simpleinstallation ?LeadssolderableperMIL-STD-202,Method208 ?Highsurgecur

SHUNYEShanghai Shunye Electronics Co.,Ltd.

順燁電子江蘇順燁電子有限公司

MBF

包裝:散裝 類(lèi)別:RF/IF,射頻/中頻和 RFID RF 配件 描述:ACCY MOUNT BMM 3/4\

TE Connectivity Laird

TE Connectivity Laird

TE Connectivity Laird

MBF10

Schottky Surface Mount Flat Bridge Rectifier

Features ◇Lowprofilepackage ◇Idealforautomatedplacement ◇Ultrafastreverserecoverytime ◇Lowpowerlosses,highefficiency ◇Lowforwardvoltagedrop ◇Highsurgecapability ◇Hightemperaturesoldering:260℃/10secondsatterminals

LUGUANGShenzhen Luguang Electronic Technology Co., Ltd

魯光電子深圳市魯光電子科技有限公司

MBF10J

Silicon Bridge Rectifiers

Features ●Glasspassivatedjunction ●Highsurgecurrentcapability ●Savesspaceonprintedcircuitboards ●Hightemperaturesolderingguaranteed:260°C/10seconds ●RoHSCompliant MechanicalData ●Case:MoldedplasticbodyRoHS-compliant ●MoldingcompoundmeetsUL94V-0flammability

BILINGalaxy Semi-Conductor Holdings Limited

世紀(jì)微電子常州銀河世紀(jì)微電子股份有限公司

MBF10K

Silicon Bridge Rectifiers

Features ●Glasspassivatedjunction ●Highsurgecurrentcapability ●Savesspaceonprintedcircuitboards ●Hightemperaturesolderingguaranteed:260°C/10seconds ●RoHSCompliant MechanicalData ●Case:MoldedplasticbodyRoHS-compliant ●MoldingcompoundmeetsUL94V-0flammability

BILINGalaxy Semi-Conductor Holdings Limited

世紀(jì)微電子常州銀河世紀(jì)微電子股份有限公司

MBF10M

Silicon Bridge Rectifiers

Features ●Glasspassivatedjunction ●Highsurgecurrentcapability ●Savesspaceonprintedcircuitboards ●Hightemperaturesolderingguaranteed:260°C/10seconds ●RoHSCompliant MechanicalData ●Case:MoldedplasticbodyRoHS-compliant ●MoldingcompoundmeetsUL94V-0flammability

BILINGalaxy Semi-Conductor Holdings Limited

世紀(jì)微電子常州銀河世紀(jì)微電子股份有限公司

MBF10N

Silicon Bridge Rectifiers

Features ●Glasspassivatedjunction ●Highsurgecurrentcapability ●Savesspaceonprintedcircuitboards ●Hightemperaturesolderingguaranteed:260°C/10seconds ●RoHSCompliant MechanicalData ●Case:MoldedplasticbodyRoHS-compliant ●MoldingcompoundmeetsUL94V-0flammability

BILINGalaxy Semi-Conductor Holdings Limited

世紀(jì)微電子常州銀河世紀(jì)微電子股份有限公司

MBF110

Solid-State Fingerprint Sensor

Overview TheFujitsuMBF110Solid-StateFingerprintSensorisadirectcontact,fingerprintacquisitiondevice.Itisahighperformance,lowpower,lowcost,capacitivesensorwithanintegratedtwodimensionalarrayofmetalelectrodesinthesensingarray.Eachmetalelectrodeactsasoneplate

FujitsuFujitsu Component Limited.

富士通富士通株式會(huì)社

MBF110PFW1LPES

Solid-State Fingerprint Sensor

Overview TheFujitsuMBF110Solid-StateFingerprintSensorisadirectcontact,fingerprintacquisitiondevice.Itisahighperformance,lowpower,lowcost,capacitivesensorwithanintegratedtwodimensionalarrayofmetalelectrodesinthesensingarray.Eachmetalelectrodeactsasoneplate

FujitsuFujitsu Component Limited.

富士通富士通株式會(huì)社

MBF110PFW1LPG

Solid-State Fingerprint Sensor

Overview TheFujitsuMBF110Solid-StateFingerprintSensorisadirectcontact,fingerprintacquisitiondevice.Itisahighperformance,lowpower,lowcost,capacitivesensorwithanintegratedtwodimensionalarrayofmetalelectrodesinthesensingarray.Eachmetalelectrodeactsasoneplate

FujitsuFujitsu Component Limited.

富士通富士通株式會(huì)社

MBF110PFW1STES

Solid-State Fingerprint Sensor

Overview TheFujitsuMBF110Solid-StateFingerprintSensorisadirectcontact,fingerprintacquisitiondevice.Itisahighperformance,lowpower,lowcost,capacitivesensorwithanintegratedtwodimensionalarrayofmetalelectrodesinthesensingarray.Eachmetalelectrodeactsasoneplate

FujitsuFujitsu Component Limited.

富士通富士通株式會(huì)社

MBF110PFW1STG

Solid-State Fingerprint Sensor

Overview TheFujitsuMBF110Solid-StateFingerprintSensorisadirectcontact,fingerprintacquisitiondevice.Itisahighperformance,lowpower,lowcost,capacitivesensorwithanintegratedtwodimensionalarrayofmetalelectrodesinthesensingarray.Eachmetalelectrodeactsasoneplate

FujitsuFujitsu Component Limited.

富士通富士通株式會(huì)社

MBF110PFWLPES

Solid-State Fingerprint Sensor

Overview TheFujitsuMBF110Solid-StateFingerprintSensorisadirectcontact,fingerprintacquisitiondevice.Itisahighperformance,lowpower,lowcost,capacitivesensorwithanintegratedtwodimensionalarrayofmetalelectrodesinthesensingarray.Eachmetalelectrodeactsasoneplate

FujitsuFujitsu Component Limited.

富士通富士通株式會(huì)社

MBF110PFWLPG

Solid-State Fingerprint Sensor

Overview TheFujitsuMBF110Solid-StateFingerprintSensorisadirectcontact,fingerprintacquisitiondevice.Itisahighperformance,lowpower,lowcost,capacitivesensorwithanintegratedtwodimensionalarrayofmetalelectrodesinthesensingarray.Eachmetalelectrodeactsasoneplate

FujitsuFujitsu Component Limited.

富士通富士通株式會(huì)社

MBF110PFWSTES

Solid-State Fingerprint Sensor

Overview TheFujitsuMBF110Solid-StateFingerprintSensorisadirectcontact,fingerprintacquisitiondevice.Itisahighperformance,lowpower,lowcost,capacitivesensorwithanintegratedtwodimensionalarrayofmetalelectrodesinthesensingarray.Eachmetalelectrodeactsasoneplate

FujitsuFujitsu Component Limited.

富士通富士通株式會(huì)社

MBF110PFWSTG

Solid-State Fingerprint Sensor

Overview TheFujitsuMBF110Solid-StateFingerprintSensorisadirectcontact,fingerprintacquisitiondevice.Itisahighperformance,lowpower,lowcost,capacitivesensorwithanintegratedtwodimensionalarrayofmetalelectrodesinthesensingarray.Eachmetalelectrodeactsasoneplate

FujitsuFujitsu Component Limited.

富士通富士通株式會(huì)社

MBF15M

Silicon Bridge Rectifiers

Features ●Glasspassivatedjunction ●Highsurgecurrentcapability ●Savesspaceonprintedcircuitboards ●Hightemperaturesolderingguaranteed:260°C/10seconds ●RoHSCompliant MechanicalData ●Case:MoldedplasticbodyRoHS-compliant ●MoldingcompoundmeetsUL94V-0flammability

BILINGalaxy Semi-Conductor Holdings Limited

世紀(jì)微電子常州銀河世紀(jì)微電子股份有限公司

MBF15T65PEH

650V Field Stop IGBT

GeneralDescription ThisIGBTisproducedusingadvancedMagnaChip’sFieldStopTrenchIGBTTechnology,whichprovideshighperformance,excellentqualityandhighruggedness. Thisdeviceisformotorcontrol. Features ■Highruggednessformotorcontrol ■VCE(sat)positivetemperaturecoeffi

MGCHIP

MagnaChip Semiconductor.

MBF2-MBF10

Low profile package

Features ◇Lowprofilepackage ◇Idealforautomatedplacement ◇Ultrafastreverserecoverytime ◇Lowpowerlosses,highefficiency ◇Lowforwardvoltagedrop ◇Highsurgecapability ◇Hightemperaturesoldering:260℃/10secondsatterminals

LUGUANGShenzhen Luguang Electronic Technology Co., Ltd

魯光電子深圳市魯光電子科技有限公司

MBF2-MBF10

Low profile package

Features ◇Lowprofilepackage ◇Idealforautomatedplacement ◇Ultrafastreverserecoverytime ◇Lowpowerlosses,highefficiency ◇Lowforwardvoltagedrop ◇Highsurgecapability ◇Hightemperaturesoldering:260℃/10secondsatterminals

LUGUANGShenzhen Luguang Electronic Technology Co., Ltd

魯光電子深圳市魯光電子科技有限公司

產(chǎn)品屬性

  • 產(chǎn)品編號(hào):

    MBF

  • 制造商:

    TE Connectivity Laird

  • 類(lèi)別:

    RF/IF,射頻/中頻和 RFID > RF 配件

  • 包裝:

    散裝

  • 配件類(lèi)型:

    安裝

  • 描述:

    ACCY MOUNT BMM 3/4\

供應(yīng)商型號(hào)品牌批號(hào)封裝庫(kù)存備注價(jià)格
LAIRD
20+
射頻元件
155
就找我吧!--邀您體驗(yàn)愉快問(wèn)購(gòu)元件!
詢(xún)價(jià)
TE
23+
NA
8664
確保原裝正品,專(zhuān)注終端客戶(hù)一站式BOM配單
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MOTOROLA
24+
69000
現(xiàn)貨供應(yīng)
詢(xún)價(jià)
日立
23+
模塊
3562
詢(xún)價(jià)
HITACHI
23+
模塊
350
全新原裝正品,量大可訂貨!可開(kāi)17%增值票!價(jià)格優(yōu)勢(shì)!
詢(xún)價(jià)
ASJ
06+
原廠原裝
9216
只做全新原裝真實(shí)現(xiàn)貨供應(yīng)
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MOTOROLA
16+
CAN
280
原裝現(xiàn)貨假一罰十
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OKI
23+
CAN3
5000
原裝正品,假一罰十
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OKI
24+
QFN
6980
原裝現(xiàn)貨,可開(kāi)13%稅票
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FUJ
2339+
SSOP
4652
公司原廠原裝現(xiàn)貨假一罰十!特價(jià)出售!強(qiáng)勢(shì)庫(kù)存!
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更多MBF供應(yīng)商 更新時(shí)間2021-9-14 10:50:00