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MD-219

19-inch marine display

moxaMOXA

臺灣摩莎摩莎科技（上海）有限公司

MICRF219

300MHzto450MHzASKReceiverwithRSSI,Auto-Poll,Bit-CheckandSquelch

GENERALDESCRIPTION TheMICRF219isa300MHzto450MHzsuper-heterodyne,image-reject,RFreceiverwithAutomaticGainControl,OOK/ASKdemodulatorandanalogRSSIoutput.ThedeviceintegratesAuto-Poll,ValidBit-Check,Squelch,andDesensefeatures.Itonlyrequiresacrystalandaminimumof

MicrelMicrel Semiconductor

麥瑞半導(dǎo)體

MICRF219

300MHzto450MHzASKReceiverwithRSSI,Auto-Poll,Bit-Che

MicrelMicrel Semiconductor

麥瑞半導(dǎo)體

MICRF219A

ASK/OOKReceiver

GeneralDescription TheMICRF219Aisa300MHzto450MHzsuper-heterodyne,image-reject,RFreceiverwithautomaticgaincontrol,ASK/OOKdemodulator,andanalogRSSIoutput.Itonlyrequiresacrystalandaminimumnumberofexternalcomponentstoimplement.TheMICRF219Aisidealforlow-cost,l

MicrelMicrel Semiconductor

麥瑞半導(dǎo)體

MICRF219AAYQS

300MHzto450MHzASK/OOKReceiverwithAuto-Poll,andRSSI

MicrelMicrel Semiconductor

麥瑞半導(dǎo)體

MICRF219AAYQS

ASK/OOKReceiver

GeneralDescription TheMICRF219Aisa300MHzto450MHzsuper-heterodyne,image-reject,RFreceiverwithautomaticgaincontrol,ASK/OOKdemodulator,andanalogRSSIoutput.Itonlyrequiresacrystalandaminimumnumberofexternalcomponentstoimplement.TheMICRF219Aisidealforlow-cost,l

MicrelMicrel Semiconductor

麥瑞半導(dǎo)體

MICRF219AYQS

300MHzto450MHzASKReceiverwithRSSI,Auto-Poll,Bit-Che

MicrelMicrel Semiconductor

麥瑞半導(dǎo)體

MO-219

TheFlipStack?CSPfamilyutilizesAmkor’sindustryleadingChipArray?BallGridArray(CABGA)manufacturingcapabilities

FEATURES Packageheightdownto0.6mm Design,assemblyandtestcapabilitiesthatenablestackingcombinationsofmemory,logicandmixedsignaltypedevices EstablishedpackageinfrastructurewithstandardCABGAandfcCSPfootprints Consistentproductperformancewithhighyieldsandrel

amkor

Amkor Technology

MZ219

3WATTZENERDIODES

3WATTZENERDIODES AvailableNon-RoHS(standard)orRoHScompliant(addPBFsuffix). Availableas“HR”(highreliability)screenedperMIL-PRF-19500,JANTXlevel.Add“HR”suffixtobasepartnumber.

DIGITRON

Digitron Semiconductors

MZ219

3WATTGLASSZENERDIODES

FEATURES ●Microminiaturepackage. ●Voidlesshermeticallysealedglasspackage. ●Triplelayerpassivation. ●Metallurgicallybonded. ●Highperformancecharacteristics. ●Stableoperationattemperatureto200°C ●Verylowthermalimpedance.

MicrosemiMicrosemi Corporation

美高森美美高森美公司

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1585
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5000
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5000
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M/A-COM
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13000
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8600
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M/A-COM
NA
90000
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4285
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YOUTH
2021+
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16500
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M-SYSTEN
2339+
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5632
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DIP-32
8560
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更多MD-219供應(yīng)商 更新時(shí)間2025-1-24 14:57:00

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