MH32V7245BST-6中文資料三菱電機(jī)數(shù)據(jù)手冊PDF規(guī)格書

DESCRIPTION

The MH32V7245BST is 33554432-word x 72-bit dynamic ram stacked structural module. This consist of thirty-six industry standard 16M x 4 dynamic RAMs in TSOP and two industry standard input buffer in TSSOP.

The stacked structure of TSOP on a card edge dual in-line package provides any application where high densities and large of quantities memory are required.

This is a socket-type memory module ,suitable for easy interchange or addition of module.

FEATURES

? Utilizes industry standard 16M x 4 RAMs TSOP and industry standard input buffer in TSSOP

? 168-pin (84-pin dual dual in-line package) stacked structure

? Single 3.3V(+/- 0.3V) supply operation

? Low stand-by power dissipation . . . . . . . . . . 64.9mW(Max)

? Low operation power dissipation

MH32V7245BST -5 . . . . . . . . . . . . . . . . . . 8.44W(Max)

MH32V7245BST -6 . . . . . . . . . . . . . . . . . . 7.79W(Max)

? All input are directly LVTTL compatible

? All output are three-state and directry LVTTL compatible

? Includes(0.22 uF x 38) decoupling capacitors

? 4096 refresh cycle every 64ms (A0 - A11)

? Hyper-page mpde,Read-modify-write,/CAS before /RAS refresh, Hidden refresh capabilities

? JEDEC standard pin configration & Buffered PD pin

? Buffered input except /RAS and DQ

? Gold plating contact pads

APPLICATION

Main memory unit for computers , Microcomputer memory