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MLPF-WB-02D3中文資料意法半導(dǎo)體數(shù)據(jù)手冊(cè)PDF規(guī)格書

MLPF-WB-02D3
廠商型號(hào)

MLPF-WB-02D3

功能描述

2.4 GHz low pass filter matched to STM32WB5x and STM32WB1x in WLCSP and UFBGA packages

絲印標(biāo)識(shí)

TX

封裝外殼

CSPG

文件大小

2.31802 Mbytes

頁面數(shù)量

13

生產(chǎn)廠商 STMicroelectronics
企業(yè)簡稱

STMICROELECTRONICS意法半導(dǎo)體

中文名稱

意法半導(dǎo)體集團(tuán)官網(wǎng)

原廠標(biāo)識(shí)
數(shù)據(jù)手冊(cè)

下載地址一下載地址二到原廠下載

更新時(shí)間

2025-2-4 17:08:00

MLPF-WB-02D3規(guī)格書詳情

Features

? Integrated impedance matching to STM32WB5x and STM32WB1x in WLCSP

and UFBGA packages

? 50 Ω nominal impedance on antenna side

? Deep rejection harmonics filter

? Low insertion loss

? Small footprint

? Low profile ≤ 630 μm after reflow

? High RF performances

? RF BOM and area reduction

? ECOPACK2 compliant component

Applications

? Bluetooth 5

? OpenThread

? Zigbee?

? IEEE 802.15.4

? Optimized for STM32WB5x and STM32WB1x in WLCSP and UFBGA

packages

Description

The MLPF-WB-02D3 integrates an impedance matching network and harmonics

filter. The matching impedance network has been tailored to maximize the RF

performances of STM32WB5x and STM32WB1x in WLCSP and UFBGA packages.

This device uses STMicroelectronics IPD technology on non-conductive glass

substrate which optimizes RF performances.

供應(yīng)商 型號(hào) 品牌 批號(hào) 封裝 庫存 備注 價(jià)格
ST
CSP6
893993
集團(tuán)化配單-有更多數(shù)量-免費(fèi)送樣-原包裝正品現(xiàn)貨-正規(guī)
詢價(jià)
STMICROELECTRONICS
22+
SMD
518000
明嘉萊只做原裝正品現(xiàn)貨
詢價(jià)
ST/意法半導(dǎo)體
21+
BumplessCSP-6
6000
原裝現(xiàn)貨
詢價(jià)
ST/意法半導(dǎo)體
21+
BumplessCSP-6
8080
只做原裝,質(zhì)量保證
詢價(jià)
6000
詢價(jià)
ST/意法
22+
BumplessCSP-6
18000
原裝正品
詢價(jià)
ST(意法半導(dǎo)體)
23+
5001
原裝現(xiàn)貨,免費(fèi)供樣,技術(shù)支持,原廠對(duì)接
詢價(jià)
ST
2021+
SMD
100500
一級(jí)代理專營品牌!原裝正品,優(yōu)勢現(xiàn)貨,長期排單到貨
詢價(jià)
ST/意法半導(dǎo)體
24+
BumplessCSP-6
6000
原廠原裝 歡迎詢價(jià)
詢價(jià)
ST/意法半導(dǎo)體
23+
BumplessCSP-6
6000
只做原裝,實(shí)單可談
詢價(jià)