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MO-216中文資料amkor數(shù)據(jù)手冊PDF規(guī)格書

MO-216
廠商型號(hào)

MO-216

功能描述

The FlipStack? CSP family utilizes Amkor’s industry leading ChipArray? Ball Grid Array (CABGA) manufacturing capabilities

文件大小

728.44 Kbytes

頁面數(shù)量

2

生產(chǎn)廠商 Amkor Technology
企業(yè)簡稱

amkor

中文名稱

Amkor Technology官網(wǎng)

原廠標(biāo)識(shí)
數(shù)據(jù)手冊

下載地址一下載地址二到原廠下載

更新時(shí)間

2025-3-15 23:00:00

人工找貨

MO-216價(jià)格和庫存,歡迎聯(lián)系客服免費(fèi)人工找貨

MO-216規(guī)格書詳情

FEATURES

Package height down to 0.6 mm

Design, assembly and test capabilities that enable stacking combinations of memory, logic and mixed signal type devices

Established package infrastructure with standard CABGA and fcCSP footprints

Consistent product performance with high yields and reliability

Die overhang wirebonding

Low loop wirebonding to 40 μm or less

Pb-free, RoHS compliant and green materials

Passive component integration options

JEDEC standard outlines including MO-192, MO-195, MO-216, MO-219 and MO-298

Applications

FlipStack? CSP technology enables smaller, lighter and more innovative new product form factors at a lower cost. This solution address es a range of design requirements, and enables a wide variety of applications, including portable multimedia devices such as tablets, cell phones and digital cameras.

供應(yīng)商 型號(hào) 品牌 批號(hào) 封裝 庫存 備注 價(jià)格
ST/意法
23+
NA/
33250
原裝現(xiàn)貨,當(dāng)天可交貨,原型號(hào)開票
詢價(jià)
ST
2020+
SOP-8
80000
只做自己庫存,全新原裝進(jìn)口正品假一賠百,可開13%增
詢價(jià)
FSC
24+
TO-220
35200
一級(jí)代理/放心采購
詢價(jià)
ST
07+
SOP-8
30000
一級(jí)代理,專注軍工、汽車、醫(yī)療、工業(yè)、新能源、電力
詢價(jià)
ST
24+
SOP
2560
絕對(duì)原裝!現(xiàn)貨熱賣!
詢價(jià)
ST
22+23+
SOIC3.9mm
8295
絕對(duì)原裝正品全新進(jìn)口深圳現(xiàn)貨
詢價(jià)
ST/意法
2022
SOP-8
80000
原裝現(xiàn)貨,OEM渠道,歡迎咨詢
詢價(jià)
ASJ
1535+
12997
詢價(jià)
24+
QFN
6900
詢價(jià)
ST/意法
24+
SOIC
9600
原裝現(xiàn)貨,優(yōu)勢供應(yīng),支持實(shí)單!
詢價(jià)