MPC105EC/D中文資料恩智浦?jǐn)?shù)據(jù)手冊PDF規(guī)格書

MPC105 Features

Major features of the MPC105 are as follows:

? Processor interface

— 60x processors supported at a wide range of frequencies

— 32-bit address bus

— Configurable 64- or 32-bit data bus

— Accommodates an upgrade of either an external L2 cache or a secondary processor

— Arbitration for secondary processor on-chip

— Full memory coherency supported

— Pipelining of 60x accesses

— Store gathering on 60x-to-PCI writes

? Secondary (L2) cache control

— Configurable for write-through or write-back operation

— 256K, 512K, 1M sizes

— Up to 4 Gbytes of cacheable space

— Direct-mapped

— Parity supported

— Supports external byte decode or on-chip byte decode for write enables

— Programmable timing supported

— Synchronous burst and asynchronous SRAMs supported

? PCI interface

— Compliant with PCI Local Bus Specification, Revision 2.0

— Supports PCI interlocked accesses to memory using LOCK signal and protocol

— Supports accesses to all PCI address spaces

— Selectable big- or little-endian operation

— Store gathering on PCI writes to memory

— Selectable memory prefetching of PCI read accesses

— Only one external load presented by the MPC105 to the PCI bus

— PCI configuration registers

— Interface operates at 16–33 MHz

— Data buffering (in/out)

— Parity supported

— 3.3 V/5.0 V compatible

? Concurrent transactions on 60x and PCI buses supported

? Memory interface

— Programmable timing supported

— Supports either DRAM or SDRAM

— High bandwidth (64-bit) data bus

— Supports self-refreshing DRAM in sleep and suspend modes

— Supports 1 to 8 banks built of x1, x4, x8, x9, x16, or x18 DRAMs

— Supports PowerPC reference platform-compliant contiguous or discontiguous memory maps

— 1 Gbyte of RAM space, 16 Mbytes of ROM space

— Supports 8-bit asynchronous ROM or 32-/64-bit burst-mode ROM

— Supports writing to Flash ROM

— Configurable external buffer control logic

— Parity supported

— TTL compatible

? Power management

— Fully-static 3.3 V CMOS design

— Supports 60x nap, doze, and sleep power management modes, and suspend mode

? IEEE 1149.1-compliant, JTAG boundary-scan interface

? 304-pin ball grid array (BGA) package