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MPC8360集成電路(IC)的微處理器規(guī)格書PDF中文資料

MPC8360
廠商型號

MPC8360

參數(shù)屬性

MPC8360 封裝/外殼為740-LBGA;包裝為托盤;類別為集成電路(IC)的微處理器;產(chǎn)品描述:IC MPU MPC83XX 533MHZ 740TBGA

功能描述

PowerQUICC II Pro Processor Revision 2.x TBGA Silicon Hardware Specifications

封裝外殼

740-LBGA

文件大小

1.20024 Mbytes

頁面數(shù)量

102

生產(chǎn)廠商 NXP Semiconductors
企業(yè)簡稱

nxp恩智浦

中文名稱

恩智浦半導體公司官網(wǎng)

原廠標識
數(shù)據(jù)手冊

下載地址一下載地址二到原廠下載

更新時間

2025-3-20 11:22:00

人工找貨

MPC8360價格和庫存,歡迎聯(lián)系客服免費人工找貨

MPC8360規(guī)格書詳情

This document provides an overview of the MPC8360E/58E

PowerQUICC II Pro processor revision 2.x TBGA features, including a

block diagram showing the major functional components. This device is

a cost-effective, highly integrated communications processor that

addresses the needs of the networking, wireless infrastructure, and

telecommunications markets. Target applications include next generation

DSLAMs, network interface cards for 3G base stations (Node Bs),

routers, media gateways, and high end IADs. The device extends current

PowerQUICC II Pro offerings, adding higher CPU performance,

additional functionality, faster interfaces, and robust interworking

between protocols while addressing the requirements related to

time-to-market, price, power, and package size. This device can be used

for the control plane and also has data plane functionality.

For functional characteristics of the processor, refer to the MPC8360E

PowerQUICC II Pro Integrated Communications Processor Reference

Manual, Rev. 3.

To locate any updates for this document, refer to the MPC8360E product

summary page on our website listed on the back cover of this document

or contact your Freescale sales office.

產(chǎn)品屬性

  • 產(chǎn)品編號:

    MPC8360CVVAJDG

  • 制造商:

    NXP USA Inc.

  • 類別:

    集成電路(IC) > 微處理器

  • 系列:

    MPC83xx

  • 包裝:

    托盤

  • 核心處理器:

    PowerPC e300

  • 內核數(shù)/總線寬度:

    1 核,32 位

  • 速度:

    533MHz

  • 協(xié)處理器/DSP:

    通信;QUICC 引擎

  • RAM 控制器:

    DDR,DDR2

  • 圖形加速:

  • 以太網(wǎng):

    10/100/1000Mbps(1)

  • USB:

    USB 1.x(1)

  • 電壓 - I/O:

    1.8V,2.5V,3.3V

  • 工作溫度:

    -40°C ~ 105°C(TA)

  • 封裝/外殼:

    740-LBGA

  • 供應商器件封裝:

    740-TBGA(37.5x37.5)

  • 描述:

    IC MPU MPC83XX 533MHZ 740TBGA

供應商 型號 品牌 批號 封裝 庫存 備注 價格
NXP/恩智浦
2023+
TBGA-740
6000
全新原裝深圳倉庫現(xiàn)貨有單必成
詢價
FSL
23+
原廠原包裝
6000
全新原裝假一賠十
詢價
FREESCALE
24+
PLCC-84
9600
原裝現(xiàn)貨,優(yōu)勢供應,支持實單!
詢價
NXP(恩智浦)
2021+
TBGA-740(37.5x37.5)
499
詢價
Freescale
23+
740-TBGA
65480
詢價
NXP/恩智浦
2020+
NA
80000
只做自己庫存,全新原裝進口正品假一賠百,可開13%增
詢價
FREESCALE
17+
BGA
6200
100%原裝正品現(xiàn)貨
詢價
FREESCALE
19+
TBGA-740PIN
85364
原廠代理渠道,每一顆芯片都可追溯原廠;
詢價
FREESCAL
25+
BGA
3386
品牌專業(yè)分銷商,可以零售
詢價
FREESCALE
23+
NA
1218
原裝正品代理渠道價格優(yōu)勢
詢價