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MPC8360VVAJDGA

PowerQUICC II Pro Processor Revision 2.x TBGA Silicon Hardware Specifications

freescaleFreescale Semiconductor, Inc

飛思卡爾飛思卡爾半導(dǎo)體

MPC8360VVAJDGA

包裝:散裝 封裝/外殼:740-LBGA 類別:集成電路(IC) 微處理器 描述:IC MPU MPC83XX 533MHZ 740TBGA

NXP USA Inc.

NXP USA Inc.

NXP USA Inc.

MPC8360VVAJDHA

PowerQUICCIIProProcessorRevision2.xTBGASiliconHardwareSpecifications

freescaleFreescale Semiconductor, Inc

飛思卡爾飛思卡爾半導(dǎo)體

MPC8360VVAJFGA

PowerQUICCIIProProcessorRevision2.xTBGASiliconHardwareSpecifications

freescaleFreescale Semiconductor, Inc

飛思卡爾飛思卡爾半導(dǎo)體

MPC8360VVAJFHA

PowerQUICCIIProProcessorRevision2.xTBGASiliconHardwareSpecifications

freescaleFreescale Semiconductor, Inc

飛思卡爾飛思卡爾半導(dǎo)體

MPC8360VVALDGA

PowerQUICCIIProProcessorRevision2.xTBGASiliconHardwareSpecifications

freescaleFreescale Semiconductor, Inc

飛思卡爾飛思卡爾半導(dǎo)體

MPC8360VVALDHA

PowerQUICCIIProProcessorRevision2.xTBGASiliconHardwareSpecifications

freescaleFreescale Semiconductor, Inc

飛思卡爾飛思卡爾半導(dǎo)體

MPC8360VVALFGA

PowerQUICCIIProProcessorRevision2.xTBGASiliconHardwareSpecifications

freescaleFreescale Semiconductor, Inc

飛思卡爾飛思卡爾半導(dǎo)體

MPC8360VVALFHA

PowerQUICCIIProProcessorRevision2.xTBGASiliconHardwareSpecifications

freescaleFreescale Semiconductor, Inc

飛思卡爾飛思卡爾半導(dǎo)體

MPC8360ZUAGDGA

PowerQUICCIIProProcessorRevision2.xTBGASiliconHardwareSpecifications

freescaleFreescale Semiconductor, Inc

飛思卡爾飛思卡爾半導(dǎo)體

MPC8360ZUAGDHA

PowerQUICCIIProProcessorRevision2.xTBGASiliconHardwareSpecifications

freescaleFreescale Semiconductor, Inc

飛思卡爾飛思卡爾半導(dǎo)體

MPC8360ZUAGFGA

PowerQUICCIIProProcessorRevision2.xTBGASiliconHardwareSpecifications

freescaleFreescale Semiconductor, Inc

飛思卡爾飛思卡爾半導(dǎo)體

MPC8360ZUAGFHA

PowerQUICCIIProProcessorRevision2.xTBGASiliconHardwareSpecifications

freescaleFreescale Semiconductor, Inc

飛思卡爾飛思卡爾半導(dǎo)體

MPC8360ZUAJDGA

PowerQUICCIIProProcessorRevision2.xTBGASiliconHardwareSpecifications

freescaleFreescale Semiconductor, Inc

飛思卡爾飛思卡爾半導(dǎo)體

MPC8360ZUAJDHA

PowerQUICCIIProProcessorRevision2.xTBGASiliconHardwareSpecifications

freescaleFreescale Semiconductor, Inc

飛思卡爾飛思卡爾半導(dǎo)體

MPC8360ZUAJFGA

PowerQUICCIIProProcessorRevision2.xTBGASiliconHardwareSpecifications

freescaleFreescale Semiconductor, Inc

飛思卡爾飛思卡爾半導(dǎo)體

MPC8360ZUAJFHA

PowerQUICCIIProProcessorRevision2.xTBGASiliconHardwareSpecifications

freescaleFreescale Semiconductor, Inc

飛思卡爾飛思卡爾半導(dǎo)體

MPC8360ZUALDGA

PowerQUICCIIProProcessorRevision2.xTBGASiliconHardwareSpecifications

freescaleFreescale Semiconductor, Inc

飛思卡爾飛思卡爾半導(dǎo)體

MPC8360ZUALDHA

PowerQUICCIIProProcessorRevision2.xTBGASiliconHardwareSpecifications

freescaleFreescale Semiconductor, Inc

飛思卡爾飛思卡爾半導(dǎo)體

MPC8360ZUALFGA

PowerQUICCIIProProcessorRevision2.xTBGASiliconHardwareSpecifications

freescaleFreescale Semiconductor, Inc

飛思卡爾飛思卡爾半導(dǎo)體

產(chǎn)品屬性

  • 產(chǎn)品編號:

    MPC8360VVAJDGA

  • 制造商:

    NXP USA Inc.

  • 類別:

    集成電路(IC) > 微處理器

  • 系列:

    MPC83xx

  • 包裝:

    散裝

  • 核心處理器:

    PowerPC e300

  • 內(nèi)核數(shù)/總線寬度:

    1 核,32 位

  • 速度:

    533MHz

  • 協(xié)處理器/DSP:

    通信;QUICC 引擎

  • RAM 控制器:

    DDR,DDR2

  • 圖形加速:

  • 以太網(wǎng):

    10/100/1000Mbps(1)

  • USB:

    USB 1.x(1)

  • 電壓 - I/O:

    1.8V,2.5V,3.3V

  • 工作溫度:

    0°C ~ 105°C(TA)

  • 封裝/外殼:

    740-LBGA

  • 供應(yīng)商器件封裝:

    740-TBGA(37.5x37.5)

  • 描述:

    IC MPU MPC83XX 533MHZ 740TBGA

供應(yīng)商型號品牌批號封裝庫存備注價格
NXP(恩智浦)
23+
TBGA-740
981
深耕行業(yè)12年,可提供技術(shù)支持。
詢價
FREESCAL
23+
BGA
19726
詢價
FREESCAL
2016+
BGA
6528
只做進(jìn)口原裝現(xiàn)貨!或者訂貨,假一賠十!
詢價
FREESCALE
16+
740-TBGA
3765
原裝現(xiàn)貨假一罰十
詢價
FREESCALE
22+
TBGA74037.53
2000
原裝現(xiàn)貨庫存.價格優(yōu)勢
詢價
Unknown
23+
NA
131
專做原裝正品,假一罰百!
詢價
Freescale
14+
1218
全新進(jìn)口原裝
詢價
Freescale
23+
740-TBGA
65480
詢價
NXP
21+
740-TBGA(37.5x37.5)
800
100%全新原裝 亞太地區(qū)XILINX、FREESCALE-NXP AD專業(yè)
詢價
NXP USA Inc.
21+
740-TBGA(37.5x37.5)
53200
一級代理/放心采購
詢價
更多MPC8360VVAJDGA供應(yīng)商 更新時間2024-12-23 14:20:00