| 零件編號 | 下載 訂購 | 功能描述/絲印 | 制造商 上傳企業(yè) | LOGO |
|---|---|---|---|---|
SMDSchottkyBarrierDiode Features -Lowforwardvoltage. -Designedformountingonsmallsurface. -Extremelythinpackage. -Majoritycarrierconduction. -AEC-Q101Qualified&PPAP. | COMCHIPComchip Technology 典琦典琦科技股份有限公司 | COMCHIP | ||
AMCCSeriesCutCoreFINEMET?F3CCSeriesCutCore | ETCList of Unclassifed Manufacturers 未分類制造商 | ETC | ||
SMDSchottkyBarrierDiode Features IO=350mA VR=20Vto40V -Lowforwardvoltage -Designedformountingonsmallsurface. -Extremelythinpackage. -Majoritycarrierconduction. -Lead-freedevice MechanicalData -Case:0603(1608)1005(2512)standardpackage,moldedplastic. -Terminals:Goldplated | ANACHIPAnachip Corp 易亨電子易亨電子股份有限公司 | ANACHIP | ||
SMDSchottkyBarrierDiode Features IO=350mA VR=20Vto40V -Lowforwardvoltage -Designedformountingonsmallsurface. -Extremelythinpackage. -Majoritycarrierconduction. -Lead-freedevice MechanicalData -Case:0603(1608)1005(2512)standardpackage,moldedplastic. -Terminals:Goldplated | ANACHIPAnachip Corp 易亨電子易亨電子股份有限公司 | ANACHIP | ||
SMDSchottkyBarrierDiode Features IO=350mA VR=20Vto40V -Lowforwardvoltage -Designedformountingonsmallsurface. -Extremelythinpackage. -Majoritycarrierconduction. -Lead-freedevice MechanicalData -Case:0603(1608)1005(2512)standardpackage,moldedplastic. -Terminals:Goldplated | ANACHIPAnachip Corp 易亨電子易亨電子股份有限公司 | ANACHIP | ||
Highreliabilitytomechanicalstress | ABRACON Abracon Corporation | ABRACON | ||
Single-EndedCordsets Basicfeatures Approval/ConformityCE cULus EAC WEEE | BalluffBalluff Korea Ltd. 巴魯夫巴魯夫集團 | Balluff | ||
SMDSchottkyBarrierDiode IO=350mA VR=20to40Volts Features Lowforwardvoltage. Designedformountingonsmallsurface. Extremelythin/leadlesspackage. Majoritycarrierconduction. Mechanicaldata Case:1005(2512)standardpackage, moldedplastic. Terminals:Gold | COMCHIPComchip Technology 典琦典琦科技股份有限公司 | COMCHIP | ||
SMDSchottkyBarrierDiode IO=350mA VR=20to40Volts Features Halogenfree. Lowforwardvoltage. Designedformountingonsmallsurface. Extremelythin/leadlesspackage. Majoritycarrierconduction. Mechanicaldata Case:1005(2512)standardpackage,moldedplastic. Terminals:Goldplat | COMCHIPComchip Technology 典琦典琦科技股份有限公司 | COMCHIP | ||
SMDSchottkyBarrierDiode IO=350mA VR=20to40Volts Features Lowforwardvoltage. Designedformountingonsmallsurface. Extremelythin/leadlesspackage. Majoritycarrierconduction. Mechanicaldata Case:1005(2512)standardpackage, moldedplastic. Terminals:Gol | COMCHIPComchip Technology 典琦典琦科技股份有限公司 | COMCHIP |
| 供應(yīng)商 | 型號 | 品牌 | 批號 | 封裝 | 庫存 | 備注 | 價格 |
|---|---|---|---|---|---|---|---|
American Power Conversion (APC |
2022+ |
1 |
全新原裝 貨期兩周 |
詢價 | |||
BudIndustries |
新 |
22 |
全新原裝 貨期兩周 |
詢價 | |||
Bud |
22+ |
NA |
80 |
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