零件編號 | 下載&訂購 | 功能描述 | 制造商&上傳企業(yè) | LOGO |
---|---|---|---|---|
TweezercartridgeforMX-PTZ | ETCList of Unclassifed Manufacturers 未分類制造商 | ETC | ||
IECDISTRIBUTIONUNITS | BULGIN BULGIN COMPONENTS PLC | BULGIN | ||
Intel?Pentium?/Celeron?ApolloLakeSoCprocessorQsevenModule Features ?OnboardIntel?Pentium?/Celeron?SoCBGAprocessor?OnboardDDR3L1600/1333MHz4GB,upto8GB?2xSATAIII,6xUSB2.0,2xUSB3.0,3xPCIe2.0?DualChannel18/24-bitLVDS+HDMI?SupportseMMC5.0,SDcard(SDIO3.0)?QsevenFormFactorRev.2.1Compliant?StandardTemperat | BCM bcm advanced search | BCM | ||
HIGHREPEATABILITY,TO-5RELAYSDPDT DESCRIPTION TheultraminiatureRF700andRF703relaysare designedtoprovideimprovedRFsignalswitching repeatabilityoverthefrequencyrange.Theserelaysare engineeredforuseinRFattenuator,RFswitchmatrices, ATEandotherapplicationsthatrequiredependable highfrequencysigna | TELEDYNE Teledyne Technologies Incorporated | TELEDYNE | ||
SiliconSchottkyBarrierDiodeforHighSpeedSwitching Features ?LowPowerconsumption(Lowreverseleakcurrent)andhighspeed(Lowcapacitance). ?Wecansupportthelineupofenvironmentalfriendlyhalogenfreetypeonyourdemand. ?UltrasmallFlatLeadPackage(UFP)issuitableforcompactandhigh-densitysurfacemountdesign. | RENESASRenesas Technology Corp 瑞薩瑞薩科技有限公司 | RENESAS | ||
SiliconSchottkyBarrierDiodeforHighSpeedSwitching Features ?LowPowerconsumption(Lowreverseleakcurrent)andhighspeed(Lowcapacitance). ?Wecansupportthelineupofenvironmentalfriendlyhalogenfreetypeonyourdemand. ?UltrasmallFlatLeadPackage(UFP)issuitableforcompactandhigh-densitysurfacemountdesign. | RENESASRenesas Technology Corp 瑞薩瑞薩科技有限公司 | RENESAS | ||
SiliconSchottkyBarrierDiodeforHighSpeedSwitching Features ?LowPowerconsumption(Lowreverseleakcurrent)andhighspeed(Lowcapacitance). ?Wecansupportthelineupofenvironmentalfriendlyhalogenfreetypeonyourdemand. ?UltrasmallFlatLeadPackage(UFP)issuitableforcompactandhigh-densitysurfacemountdesign. | RENESASRenesas Technology Corp 瑞薩瑞薩科技有限公司 | RENESAS | ||
SiliconSchottkyBarrierDiodeforHighSpeedSwitching Features ?LowPowerconsumption(Lowreverseleakcurrent)andhighspeed(Lowcapacitance). ?Wecansupportthelineupofenvironmentalfriendlyhalogenfreetypeonyourdemand. ?ExtremelysmallFlatLeadPackage(SFP)issuitableforcompactandhigh-densitysurfacemountdesign. | RENESASRenesas Technology Corp 瑞薩瑞薩科技有限公司 | RENESAS | ||
SiliconSchottkyBarrierDiodeforHighSpeedSwitching Features ?LowPowerconsumption(Lowreverseleakcurrent)andhighspeed(Lowcapacitance). ?Wecansupportthelineupofenvironmentalfriendlyhalogenfreetypeonyourdemand. ?ExtremelysmallFlatLeadPackage(SFP)issuitableforcompactandhigh-densitysurfacemountdesign. | RENESASRenesas Technology Corp 瑞薩瑞薩科技有限公司 | RENESAS | ||
SiliconSchottkyBarrierDiodeforhighSpeedSwitching Features ?LowPowerconsumption(Lowreverseleakcurrent)andhighspeed(Lowcapacitance). ?Wecansupportthelineupofenvironmentalfriendlyhalogenfreetypeonyourdemand. ?ExtremelysmallFlatLeadPackage(EFP)issuitableforcompactandhigh-densitysurfacemountdesign. | RENESASRenesas Technology Corp 瑞薩瑞薩科技有限公司 | RENESAS | ||
SiliconSchottkyBarrierDiodeforhighSpeedSwitching Features ?LowPowerconsumption(Lowreverseleakcurrent)andhighspeed(Lowcapacitance). ?Wecansupportthelineupofenvironmentalfriendlyhalogenfreetypeonyourdemand. ?ExtremelysmallFlatLeadPackage(EFP)issuitableforcompactandhigh-densitysurfacemountdesign. | RENESASRenesas Technology Corp 瑞薩瑞薩科技有限公司 | RENESAS | ||
SiliconSchottkyBarrierDiodeforHighSpeedSwitching Features ?LowPowerconsumption(Lowreverseleakcurrent)andhighspeed(Lowcapacitance). ?Halogenfree,EnvironmentalfriendlyPackageincludeConformitytoRoHSDirective. ?UltrasmallPackage(0.6mm×0.3mmSizeleadlesstype) | RENESASRenesas Technology Corp 瑞薩瑞薩科技有限公司 | RENESAS | ||
3LTAPEANDREELDATA | AOSMDAlpha & Omega Semiconductors 萬國半導體美國萬國半導體 | AOSMD | ||
SILICONGATEENHANCEMENTMODERFPOWERVDMOSTRANSISTOR GeneralDescription SiliconVDMOSandLDMOStransistorsdesignedspecificallyforbroadbandRFapplications.SuitableforMilitaryRadios,CellularandPagingAmplifierBaseStations,BroadcastFM/AM,MRI,LaserDriverandothers. Polyfetprocessfeatureslowfeedbackandoutputcapacitances,re | Polyfet Polyfet RF Devices | Polyfet | ||
FASTRECOVERYDIODESHockeyPukVersion Features ■HighpowerFASTrecoverydiodeseries ■2.0to3.0μsrecoverytime ■Highvoltageratingsupto2500V ■Highcurrentcapability ■Optimizedturnonandturnoffcharacteristics ■Lowforwardrecovery ■Fastandsoftreverserecovery ■Press-pukencapsulation ■Casestyleconfo | IRF International Rectifier | IRF | ||
RFIDSystemswithISO/IEC18000-3(15693)Compliance | OMRONOmron Electronics LLC 歐姆龍歐姆龍株式會社 | OMRON | ||
VariableCapacitanceDiode | AUK AUK corp | AUK | ||
VariableCapacitanceDiode Descriptions ?ForFMtuner ?Monolithicchipwithcommoncathodeforperfecttackingofbothdiodes ?Uniform“squarelaw”characteristics ?Idealhifituningdevicewhenusedinlow-distortion,back-to-backconfiguration Features ?Lowseriesresistance :rs=0.3?(Typ.) | AUK AUK corp | AUK | ||
TheSE-703isamicroprocessor-basedearth-fault | Littelfuselittelfuse 力特力特公司 | Littelfuse | ||
TheSE-703isamicroprocessor-basedearth-fault | Littelfuselittelfuse 力特力特公司 | Littelfuse |
供應商 | 型號 | 品牌 | 批號 | 封裝 | 庫存 | 備注 | 價格 |
---|---|---|---|---|---|---|---|
POWER |
2020+ |
ESIP7C |
80000 |
只做自己庫存,全新原裝進口正品假一賠百,可開13%增 |
詢價 | ||
PI |
22+ |
NA |
500000 |
萬三科技,秉承原裝,購芯無憂 |
詢價 | ||
POWER |
09+ |
ZIP6 |
21 |
一級代理,專注軍工、汽車、醫(yī)療、工業(yè)、新能源、電力 |
詢價 | ||
POWER |
ZIP6 |
9869 |
集團化配單-有更多數(shù)量-免費送樣-原包裝正品現(xiàn)貨-正規(guī) |
詢價 | |||
POWER |
589220 |
16余年資質 絕對原盒原盤 更多數(shù)量 |
詢價 | ||||
POWER |
2023+ |
eSIP-6 |
8800 |
正品渠道現(xiàn)貨 終端可提供BOM表配單。 |
詢價 | ||
POWER |
23+ |
ZIP6 |
5862 |
全新原裝正品現(xiàn)貨,支持訂貨 |
詢價 | ||
POWER |
23+ |
原裝正品現(xiàn)貨 |
10000 |
eSIP-6 |
詢價 | ||
Power現(xiàn)貨 |
2022+ |
7-SSIP,6引線,裸露焊盤,成形 |
350000 |
專注工業(yè)、軍工級別芯片,十五年優(yōu)質供應商 |
詢價 | ||
Power Integrations |
24+ |
eSIP-7G |
36500 |
一級代理/放心采購 |
詢價 |
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