PMF90CA中文資料森美特數(shù)據(jù)手冊PDF規(guī)格書
PMF90CA規(guī)格書詳情
Features
For surface mounted applications
Low profile package
clamping capability
cycle):0.01
High temperature soldering guaranteed:
260 ℃/10 seconds, at terminals
200W peak pulse power capability wi t h a 10/1000 μ
Low incremental surge resistance, excellent
s
wave from,repetition rate (duty
| 供應(yīng)商 | 型號 | 品牌 | 批號 | 封裝 | 庫存 | 備注 | 價格 |
|---|---|---|---|---|---|---|---|
QUALCOMM/高通 |
19+ |
BGA |
12378 |
進口原裝現(xiàn)貨 |
詢價 | ||
QUALCOMM/高通 |
23+ |
NA/ |
10 |
優(yōu)勢代理渠道,原裝正品,可全系列訂貨開增值稅票 |
詢價 | ||
QUALCOMM/高通 |
24+ |
BGA |
880000 |
明嘉萊只做原裝正品現(xiàn)貨 |
詢價 | ||
SUNMATE(森美特) |
2019+ROHS |
SOD-123 |
66688 |
森美特高品質(zhì)產(chǎn)品原裝正品免費送樣 |
詢價 | ||
NXP/恩智浦 |
22+ |
SOT1118 |
94832 |
鄭重承諾只做原裝進口現(xiàn)貨 |
詢價 | ||
原裝正品 |
24+ |
NA |
66300 |
一級代理/全新原裝現(xiàn)貨/長期供應(yīng)! |
詢價 | ||
NXP/恩智浦 |
24+ |
SOT23 |
1200 |
原裝現(xiàn)貨假一賠十 |
詢價 | ||
QUALCOMM/高通 |
2022+ |
BGA |
8600 |
英瑞芯只做原裝正品 |
詢價 | ||
NXP |
2011+PB |
UDFN-6 |
200000 |
詢價 | |||
QUALCOMM/高通 |
22+ |
BGA |
20000 |
原裝現(xiàn)貨,實單支持 |
詢價 |
