首頁(yè) >QCNW-A703WJZZ>規(guī)格書(shū)列表
零件編號(hào) | 下載&訂購(gòu) | 功能描述 | 制造商&上傳企業(yè) | LOGO |
---|---|---|---|---|
Intel?Pentium?/Celeron?ApolloLakeSoCprocessorQsevenModule Features ?OnboardIntel?Pentium?/Celeron?SoCBGAprocessor?OnboardDDR3L1600/1333MHz4GB,upto8GB?2xSATAIII,6xUSB2.0,2xUSB3.0,3xPCIe2.0?DualChannel18/24-bitLVDS+HDMI?SupportseMMC5.0,SDcard(SDIO3.0)?QsevenFormFactorRev.2.1Compliant?StandardTemperat | BCM bcm advanced search | BCM | ||
HIGHREPEATABILITY,TO-5RELAYSDPDT DESCRIPTION TheultraminiatureRF700andRF703relaysare designedtoprovideimprovedRFsignalswitching repeatabilityoverthefrequencyrange.Theserelaysare engineeredforuseinRFattenuator,RFswitchmatrices, ATEandotherapplicationsthatrequiredependable highfrequencysigna | TELEDYNE Teledyne Technologies Incorporated | TELEDYNE | ||
SiliconSchottkyBarrierDiodeforHighSpeedSwitching Features ?LowPowerconsumption(Lowreverseleakcurrent)andhighspeed(Lowcapacitance). ?Wecansupportthelineupofenvironmentalfriendlyhalogenfreetypeonyourdemand. ?UltrasmallFlatLeadPackage(UFP)issuitableforcompactandhigh-densitysurfacemountdesign. | RENESASRenesas Technology Corp 瑞薩瑞薩科技有限公司 | RENESAS | ||
SiliconSchottkyBarrierDiodeforHighSpeedSwitching Features ?LowPowerconsumption(Lowreverseleakcurrent)andhighspeed(Lowcapacitance). ?Wecansupportthelineupofenvironmentalfriendlyhalogenfreetypeonyourdemand. ?UltrasmallFlatLeadPackage(UFP)issuitableforcompactandhigh-densitysurfacemountdesign. | RENESASRenesas Technology Corp 瑞薩瑞薩科技有限公司 | RENESAS | ||
SiliconSchottkyBarrierDiodeforHighSpeedSwitching Features ?LowPowerconsumption(Lowreverseleakcurrent)andhighspeed(Lowcapacitance). ?Wecansupportthelineupofenvironmentalfriendlyhalogenfreetypeonyourdemand. ?UltrasmallFlatLeadPackage(UFP)issuitableforcompactandhigh-densitysurfacemountdesign. | RENESASRenesas Technology Corp 瑞薩瑞薩科技有限公司 | RENESAS | ||
SiliconSchottkyBarrierDiodeforHighSpeedSwitching Features ?LowPowerconsumption(Lowreverseleakcurrent)andhighspeed(Lowcapacitance). ?Wecansupportthelineupofenvironmentalfriendlyhalogenfreetypeonyourdemand. ?ExtremelysmallFlatLeadPackage(SFP)issuitableforcompactandhigh-densitysurfacemountdesign. | RENESASRenesas Technology Corp 瑞薩瑞薩科技有限公司 | RENESAS | ||
SiliconSchottkyBarrierDiodeforHighSpeedSwitching Features ?LowPowerconsumption(Lowreverseleakcurrent)andhighspeed(Lowcapacitance). ?Wecansupportthelineupofenvironmentalfriendlyhalogenfreetypeonyourdemand. ?ExtremelysmallFlatLeadPackage(SFP)issuitableforcompactandhigh-densitysurfacemountdesign. | RENESASRenesas Technology Corp 瑞薩瑞薩科技有限公司 | RENESAS | ||
SiliconSchottkyBarrierDiodeforhighSpeedSwitching Features ?LowPowerconsumption(Lowreverseleakcurrent)andhighspeed(Lowcapacitance). ?Wecansupportthelineupofenvironmentalfriendlyhalogenfreetypeonyourdemand. ?ExtremelysmallFlatLeadPackage(EFP)issuitableforcompactandhigh-densitysurfacemountdesign. | RENESASRenesas Technology Corp 瑞薩瑞薩科技有限公司 | RENESAS | ||
SiliconSchottkyBarrierDiodeforhighSpeedSwitching Features ?LowPowerconsumption(Lowreverseleakcurrent)andhighspeed(Lowcapacitance). ?Wecansupportthelineupofenvironmentalfriendlyhalogenfreetypeonyourdemand. ?ExtremelysmallFlatLeadPackage(EFP)issuitableforcompactandhigh-densitysurfacemountdesign. | RENESASRenesas Technology Corp 瑞薩瑞薩科技有限公司 | RENESAS | ||
SiliconSchottkyBarrierDiodeforHighSpeedSwitching Features ?LowPowerconsumption(Lowreverseleakcurrent)andhighspeed(Lowcapacitance). ?Halogenfree,EnvironmentalfriendlyPackageincludeConformitytoRoHSDirective. ?UltrasmallPackage(0.6mm×0.3mmSizeleadlesstype) | RENESASRenesas Technology Corp 瑞薩瑞薩科技有限公司 | RENESAS | ||
3LTAPEANDREELDATA | AOSMDAlpha & Omega Semiconductors 萬(wàn)國(guó)半導(dǎo)體美國(guó)萬(wàn)國(guó)半導(dǎo)體 | AOSMD | ||
SILICONGATEENHANCEMENTMODERFPOWERVDMOSTRANSISTOR GeneralDescription SiliconVDMOSandLDMOStransistorsdesignedspecificallyforbroadbandRFapplications.SuitableforMilitaryRadios,CellularandPagingAmplifierBaseStations,BroadcastFM/AM,MRI,LaserDriverandothers. Polyfetprocessfeatureslowfeedbackandoutputcapacitances,re | Polyfet Polyfet RF Devices | Polyfet | ||
FASTRECOVERYDIODESHockeyPukVersion Features ■HighpowerFASTrecoverydiodeseries ■2.0to3.0μsrecoverytime ■Highvoltageratingsupto2500V ■Highcurrentcapability ■Optimizedturnonandturnoffcharacteristics ■Lowforwardrecovery ■Fastandsoftreverserecovery ■Press-pukencapsulation ■Casestyleconfo | IRF International Rectifier | IRF | ||
RFIDSystemswithISO/IEC18000-3(15693)Compliance | OMRONOmron Electronics LLC 歐姆龍歐姆龍株式會(huì)社 | OMRON | ||
VariableCapacitanceDiode | AUK AUK corp | AUK | ||
VariableCapacitanceDiode Descriptions ?ForFMtuner ?Monolithicchipwithcommoncathodeforperfecttackingofbothdiodes ?Uniform“squarelaw”characteristics ?Idealhifituningdevicewhenusedinlow-distortion,back-to-backconfiguration Features ?Lowseriesresistance :rs=0.3?(Typ.) | AUK AUK corp | AUK | ||
TheSE-703isamicroprocessor-basedearth-fault | Littelfuselittelfuse 力特力特公司 | Littelfuse | ||
TheSE-703isamicroprocessor-basedearth-fault | Littelfuselittelfuse 力特力特公司 | Littelfuse | ||
TheSE-703isamicroprocessor-basedearth-fault | Littelfuselittelfuse 力特力特公司 | Littelfuse | ||
TheSE-703isamicroprocessor-basedearth-fault | Littelfuselittelfuse 力特力特公司 | Littelfuse |
詳細(xì)參數(shù)
- 型號(hào):
QCNW-A703WJZZ
- 制造商:
Sharp Microelectronics Corporation
- 功能描述:
USB CABLEVLZ5U
供應(yīng)商 | 型號(hào) | 品牌 | 批號(hào) | 封裝 | 庫(kù)存 | 備注 | 價(jià)格 |
---|---|---|---|---|---|---|---|
QVS |
23+ |
65480 |
詢價(jià) | ||||
新 |
200 |
全新原裝 貨期兩周 |
詢價(jià) | ||||
QVSTECH |
24+ |
1727 |
詢價(jià) | ||||
37 |
全新原裝進(jìn)口自己庫(kù)存優(yōu)勢(shì) |
詢價(jià) | |||||
23+ |
20000 |
全新原裝假一賠十 |
詢價(jià) | ||||
MAGIC |
24+ |
64580 |
原裝現(xiàn)貨假一賠十 |
詢價(jià) | |||
QANTEK |
2022+ |
原廠原包裝 |
6800 |
全新原裝 支持表配單 中國(guó)著名電子元器件獨(dú)立分銷(xiāo) |
詢價(jià) | ||
Panduit Corp |
2010+ |
N/A |
66 |
加我qq或微信,了解更多詳細(xì)信息,體驗(yàn)一站式購(gòu)物 |
詢價(jià) | ||
AVAGO/安華高 |
23+ |
SOP8 |
11200 |
原廠授權(quán)一級(jí)代理、全球訂貨優(yōu)勢(shì)渠道、可提供一站式BO |
詢價(jià) | ||
AGILENT |
16+ |
原裝進(jìn)口原廠原包接受訂貨 |
1000 |
原裝現(xiàn)貨假一罰十 |
詢價(jià) |
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