QFP-SD中文資料STATSCHIP數(shù)據(jù)手冊PDF規(guī)格書
QFP-SD規(guī)格書詳情
DESCRIPTION
STATS ChipPAC’s Stacked Die QFP offering includes LQFPSD, LQFP-ep-SD and TQFP-ep-SD. LQFP-SD is a stacked die low profile QFP. LQFP-ep-SD is an exposed pad version that provides enhanced thermal performance. TQFP-ep-SD is a thin profile exposed pad version with enhanced thermal performance. STATS ChipPAC’s chip stacking technology allows the integration of multiple ICs within a single package to improve package performance and functionality while reducing overall package size and cost.
FEATURES
? Combining devices into one package reduces PCB real estate and cost
? Increased sub-system performance by integrating multiple chips into a single package
? Die to die bonding capability for device/signal integration
? Standard and green/lead-free materials and Pb-free plating
? Options for mixed technologies, 2 or more stacked dice
? Fine pitch bonding capability
? Exposed pad provides enhanced thermal performance
? Low profile package thickness of 1.40mm (LQFP-SD and LQFP-ep-SD); 1.00mm (TQFP-ep-SD)
? Lead pitch ranges from 0.80mm to 0.40mm
? Pin count ranges from 32 to 208 leads (LQFP-SD), 64 to 216 leads (LQFP-ep-SD), 32 to 100 leads (TQFP-ep-SD)
? JEDEC standard compliant package outlines
產(chǎn)品屬性
- 型號：
QFP-SD
- 制造商：
STATSCHIP
- 制造商全稱：
STATSCHIP
- 功能描述：
Stacked Die Quad Flat Pack
| 供應(yīng)商 | 型號 | 品牌 | 批號 | 封裝 | 庫存 | 備注 | 價格 |
|---|---|---|---|---|---|---|---|
FARADAY |
23+ |
NA |
19960 |
只做進口原裝,終端工廠免費送樣 |
詢價 | ||
AGILENT |
00+ |
光纖 |
10 |
原裝現(xiàn)貨海量庫存歡迎咨詢 |
詢價 | ||
TAIYO |
24+ |
6868 |
原裝現(xiàn)貨,可開13%稅票 |
詢價 | |||
HP |
23+ |
65480 |
詢價 | ||||
DTA |
1535+ |
324 |
詢價 | ||||
2023+ |
80000 |
一級代理/分銷渠道價格優(yōu)勢 十年芯程一路只做原裝正品 |
詢價 | ||||
TI/德州儀器 |
23+ |
TSSOP-14 |
11200 |
原廠授權(quán)一級代理、全球訂貨優(yōu)勢渠道、可提供一站式BO |
詢價 | ||
DELTA |
22+ |
NA |
500000 |
萬三科技,秉承原裝,購芯無憂 |
詢價 | ||
臺達 |
23+ |
風機 |
2000 |
優(yōu)勢貨源原裝正品 |
詢價 | ||
Samtec |
2022+ |
原廠原包裝 |
6800 |
全新原裝 支持表配單 中國著名電子元器件獨立分銷 |
詢價 |
