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R5F52316AGFM中文資料瑞薩數(shù)據(jù)手冊PDF規(guī)格書

R5F52316AGFM
廠商型號

R5F52316AGFM

功能描述

54-MHz 32-bit RX MCUs, built-in FPU, 88.56 DMIPS, up to 512-KB flash memory, various communication functions including USB 2.0 full-speed host/function/OTG, CAN, SD hostnterface,serial sound interface, capacitive touch sensing unit,

文件大小

4.00838 Mbytes

頁面數(shù)量

170

生產(chǎn)廠商 Renesas Technology Corp
企業(yè)簡稱

RENESAS瑞薩

中文名稱

瑞薩科技有限公司官網(wǎng)

原廠標(biāo)識
數(shù)據(jù)手冊

下載地址一下載地址二到原廠下載

更新時間

2024-11-18 18:30:00

R5F52316AGFM規(guī)格書詳情

Features

■ 32-bit RXv2 CPU core

? Max. operating frequency: 54 MHz

Capable of 88.56 DMIPS in operation at 54 MHz

? Enhanced DSP: 32-bit multiply-accumulate and 16-bit

multiply-subtract instructions supported

? Built-in FPU: 32-bit single-precision floating point (compliant to

IEEE754)

? Divider (fastest instruction execution takes two CPU clock cycles)

? Fast interrupt

? CISC Harvard architecture with 5-stage pipeline

? Variable-length instructions, ultra-compact code

? On-chip debugging circuit

? Memory protection unit (MPU) supported

■ Low power design and architecture

? Operation from a single 1.8-V to 5.5-V supply

? RTC capable of operating on the battery backup power supply

? Three low power consumption modes

? Low power timer (LPT) that operates during the software standby state

■ On-chip flash memory for code

? 128- to 512-Kbyte capacities

? On-board or off-board user programming

? Programmable at 1.8 V

? For instructions and operands

■ On-chip data flash memory

? 8 Kbytes (1,000,000 program/erase cycles (typ.))

? BGO (Background Operation)

■ On-chip SRAM, no wait states

? 32- to 64-Kbyte size capacities

■ Data transfer functions

? DMAC: Incorporates four channels

? DTC: Four transfer modes

■ ELC

? Module operation can be initiated by event signals without using

interrupts.

? Linked operation between modules is possible while the CPU is sleeping.

■ Reset and supply management

? Eight types of reset, including the power-on reset (POR)

? Low voltage detection (LVD) with voltage settings

■ Clock functions

? Main clock oscillator frequency: 1 to 20 MHz

? External clock input frequency: Up to 20 MHz

? Sub-clock oscillator frequency: 32.768 kHz

? PLL circuit input: 4 MHz to 12.5 MHz

? On-chip low- and high-speed oscillators, dedicated on-chip low-speed

oscillator for the IWDT

? USB-dedicated PLL circuit: 4, 6, 8, or 12 MHz

54 MHz can be set for the system clock and 48 MHz for the USB clock

? Generation of a dedicated 32.768-kHz clock for the RTC

? Clock frequency accuracy measurement circuit (CAC)

■ Realtime clock

? Adjustment functions (30 seconds, leap year, and error)

? Calendar count mode or binary count mode selectable

? Time capture function

? Time capture on event-signal input through external pins

■ Independent watchdog timer

? 15-kHz on-chip oscillator produces a dedicated clock signal to drive

IWDT operation.

■ Useful functions for IEC60730 compliance

? Self-diagnostic and disconnection-detection assistance functions for

the A/D converter, clock frequency accuracy measurement circuit,

independent watchdog timer, RAM test assistance functions using the

DOC, etc.

■ External address space

? Four CS areas (4 × 16 Mbytes)

? 8- or 16-bit bus space is selectable per area

■ MPC

? Input/output functions selectable from multiple pins

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