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RAK3172P中文資料瑞科慧聯(lián)數(shù)據(jù)手冊PDF規(guī)格書

RAK3172P
廠商型號

RAK3172P

功能描述

RAK3272S Breakout Board

文件大小

435.96 Kbytes

頁面數(shù)量

7

生產(chǎn)廠商 RAKwireless Technology Limited
企業(yè)簡稱

RAK瑞科慧聯(lián)

中文名稱

深圳市瑞科慧聯(lián)科技有限公司官網(wǎng)

原廠標識
數(shù)據(jù)手冊

下載地址一下載地址二到原廠下載

更新時間

2025-3-6 18:35:00

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RAK3172P價格和庫存,歡迎聯(lián)系客服免費人工找貨

RAK3172P規(guī)格書詳情

RAK3272S Breakout Board is specifically designed to allow easy access to the pins on the board in order to simplify development and testing. The breakout board footprint is based on the XBee form factor, and its main purpose is to allow the RAK3172 stamp module pins to be transferred to 2.54 mm headers.

The board itself has the RAK3172 at its core, integrating a STM32WLE5CC chip. It has Ultra-Low Power

Consumption of 1.69 uA in sleep mode.

This module complies with Class A, B, & C of LoRaWAN 1.0.3 specifications. It also supports LoRa Point-to-Point (P2P) communication mode, which helps you in implementing your own customized long-range LoRa network quickly.

Features

Based on RAK3172

Custom firmware using Arduino via RUI3 API

I/O ports: UART/I2C/GPIO/SPI

Serial Wire Debug (SWD) interface

Module size: 25.4 x 32.3 mm

Ultra-low-power consumption of 1.69 μA in sleep mode

Supply Voltage: 2.0 V ~ 3.6 V

Temperature Range: -20 °C ~ 85 °C

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