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RMPA2266中文資料仙童半導(dǎo)體數(shù)據(jù)手冊(cè)PDF規(guī)格書(shū)

RMPA2266
廠商型號(hào)

RMPA2266

功能描述

WCDMA Band I Power Amplifier Module

文件大小

198.71 Kbytes

頁(yè)面數(shù)量

7 頁(yè)

生產(chǎn)廠商 Fairchild Semiconductor
企業(yè)簡(jiǎn)稱

Fairchild仙童半導(dǎo)體

中文名稱

飛兆/仙童半導(dǎo)體公司官網(wǎng)

原廠標(biāo)識(shí)
數(shù)據(jù)手冊(cè)

下載地址一下載地址二到原廠下載

更新時(shí)間

2025-2-6 20:00:00

RMPA2266規(guī)格書(shū)詳情

General Description

The RMPA2266 Power Amplifier Module (PAM) is Fairchild’s latest innovation in 50? matched, surface mount modules targeting UMTS/WCDMA/HSDPA applications. Answering the call for ultra-low DC power consumption and extended battery life in portable electronics, the RMPA2266 uses novel proprietary circuitry to dramatically reduce amplifier current at low to medium RF output power levels (< +16dBm), where the handset most often operates. A simple two-state Vmode control is all that is needed to reduce operating current by more than 60 at 16dBm output power, and quiescent current (Iccq) by as much as 70 compared to traditional power-saving methods. No additional circuitry, such as DC-to-DC converters, are required to achieve this remarkable improvement in amplifier

efficiency.

Features

■ 40 WCDMA efficiency at +28dBm Pout

■ 20 WCDMA efficiency (58mA total current) at +16dBm Pout

■ Low quiescent current (Iccq): 25mA in low-power mode

■ Meets UMTS/WCDMA performance requirements

■ Meets HSDPA performance requirements

■ Single positive-supply operation with low power and shutdown modes

– 3.4V typical Vcc operation

– Low Vref (2.85V) compatible with advanced handset chipsets

■ Compact Lead-free compliant LCC package – (4.0 x 4.0 x 1.0mm nominal)

■ Industry standard pinout

■ Internally matched to 50? and DC blocked RF input/output

產(chǎn)品屬性

  • 型號(hào):

    RMPA2266

  • 制造商:

    Rochester Electronics LLC

  • 制造商:

    Fairchild Semiconductor Corporation

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