S1FLB-M_V01中文資料威世科技數(shù)據(jù)手冊PDF規(guī)格書

FEATURES

? For surface mounted applications

? Low profile package

? Ideal for automated placement

? Glass passivated

? High temperature soldering: 260 °C / 10 s at

terminals

? Wave and reflow solderable

? Compatible to SOD-123W package case outline

or SOD-123F and SOD-123FL

? Material categorization: for definitions of compliance

please see www.vishay.com/doc?99912

MECHANICAL DATA

Case: SMF (DO-219AB)

Polarity: band denotes cathode end

Weight: approx. 15 mg

Packaging codes / options:

18/10K per 13 reel (8 mm tape), MOQ = 50K

08/3K per 7 reel (8 mm tape), MOQ = 30K

Circuit configuration: single