S1MSP1M中文資料DIODES數據手冊PDF規(guī)格書

Features

- Glass Passivated Die Construction

- Ideally Suited for Automated Assembly

- Low Profile Design, Package Height Less than 1.0mm

- Low Reverse Leakage Current

- Exceptional Thermal Transfer Based on Exposed Heat Sink on the Underside of the Device

- Lead-Free Finish; RoHS Compliant (Notes 1 & 2)

- Halogen and Antimony Free. “Green” Device (Note 3)

- For automotive applications requiring specific change control

Applications

- Switching-mode power-supply applications

- DC-DC converter applications

- AC-DC adaptors/chargers

- Mobile devices

- LED lighting