S80C186XL25中文資料英特爾數(shù)據(jù)手冊(cè)PDF規(guī)格書(shū)

INTRODUCTION

Unless specifically noted, all references to the 80C186XL apply to the 80C188XL. References to pins that differ between the 80C186XL and the 80C188XL are given in parentheses.

The following Functional Description describes the base architecture of the 80C186XL. The 80C186XL is a very high integration 16-bit microprocessor. It combines 15–20 of the most common microproces sor system components onto one chip. The 80C186XL is object code compatible with the 8086/8088 microprocessors and adds 10 new in struction types to the 8086/8088 instruction set.

■ Low Power, Fully Static Versions of 80C186/80C188

■ Operation Modes:

- Enhanced Mode

- DRAM Refresh Control Unit

- Power-Save Mode

- Direct Interface to 80C187 (80C186XL Only)

- Compatible Mode

- NMOS 80186/80188 Pin-for-Pin Replacement for Non-Numerics Applications

■ Integrated Feature Set

- Static, Modular CPU

- Clock Generator

- 2 Independent DMA Channels

- Programmable Interrupt Controller

- 3 Programmable 16-Bit Timers

- Dynamic RAM Refresh Control Unit

- Programmable Memory and Peripheral Chip Select Logic

- Programmable Wait State Generator

- Local Bus Controller

- Power-Save Mode

- System-Level Testing Support (High Impedance Test Mode)

■ Completely Object Code Compatible with Existing 8086/8088 Software and Has 10 Additional Instructions over 8086/8088

■ Speed Versions Available

- 25 MHz (80C186XL25/80C188XL25)

- 20 MHz (80C186XL20/80C188XL20)

- 12 MHz (80C186XL12/80C188XL12)

■ Direct Addressing Capability to 1 MByte Memory and 64 Kbyte I/O

■ Available in 68-Pin:

- Plastic Leaded Chip Carrier (PLCC)

- Ceramic Pin Grid Array (PGA)

- Ceramic Leadless Chip Carrier (JEDEC A Package)

■ Available in 80-Pin:

- Quad Flat Pack (EIAJ)

- Shrink Quad Flat Pack (SGFP)

■ Available in Extended Temperature Range (-40°C to +85°C)