SDT23CXXL02中文資料友臺半導體數(shù)據(jù)手冊PDF規(guī)格書

Description

They feature large cross-sectional area junctions for conduction high

transient currents. They offer desirable characteristics for board level

protection including fast response time, low and clamping voltage, and

no device degradation. The devices may be used to meet the immunity

requirements of IEC61000-4-2, level 4. The size SOT-23 package makes

them ideal for use in portable electronics such as RS-422 I/Os, RS-232

I/Os, notebook computers, and servers.

Features

IEC61000-4-2 ESD 30KV Air, 30KV contact compliance

SOT-23 surface mount package

Protects bidirectional two I/O lines

Peak power dissipation of 350W under 8/20μs waveform

Working voltage: 5V, 12V ,15V,24V

Low leakage current

Low operating and clamping voltages

Solid-state silicon avalanche technology

Lead Free/RoHS compliant

Solder reflow temperature: Pure Tin-Sn, 260~270℃

Flammability rating UL 94V-0

Meets MSL level 1, per J-STD-020

AEC-Q101 qualified

Applications

RS-232 and RS-422 data lines

Microprocessor based equipment

LAN/WAN equipment

Desktops PC and serves

Notebook, Laptop and Palmtop computers

Set Top Box

Peripherals

Serial and Parallel ports