首頁(yè)>SE050F2HQ1SLASHZ018H>規(guī)格書(shū)詳情
SE050F2HQ1SLASHZ018H中文資料恩智浦?jǐn)?shù)據(jù)手冊(cè)PDF規(guī)格書(shū)
![SE050F2HQ1SLASHZ018H](https://oss.114ic.com/img3w/pdf141156.png)
廠(chǎng)商型號(hào) |
SE050F2HQ1SLASHZ018H |
功能描述 | Plug & Trust Secure Element |
文件大小 |
407.37 Kbytes |
頁(yè)面數(shù)量 |
32 頁(yè) |
生產(chǎn)廠(chǎng)商 | NXP Semiconductors |
企業(yè)簡(jiǎn)稱(chēng) |
nxp【恩智浦】 |
中文名稱(chēng) | 恩智浦半導(dǎo)體公司官網(wǎng) |
原廠(chǎng)標(biāo)識(shí) | ![]() |
數(shù)據(jù)手冊(cè) | |
更新時(shí)間 | 2025-2-11 17:34:00 |
相關(guān)芯片規(guī)格書(shū)
更多SE050F2HQ1SLASHZ018H規(guī)格書(shū)詳情
Key features
The SE050 is based on NXP's Integral Security Architecture 3.0? providing a secure
and efficient protection against various security threats. The efficiency of the security
measures is proven by a Common Criteria EAL6+ certification.
The SE050 operates fully autonomously based on an integrated Javacard operating
system and applet. Direct memory access is possible by the fixed functionalities of the
applet only. With that, the content from the memory is fully isolated from the host system.
? Built on NXP Integral Security Architecture 3.0 ?
? CC EAL 6+ certified HW and OS as environment to run NXP IoT applications,
supporting fully encrypted communications and secured lifecycle management
? FIPS 140-2 certified platform with Security Level 3 for OS and Applet, and Security
Level 4 related to Physical Security of the HW
– Disclaimer: FIPS certification require a specific product type. For more information,
refer to [4].
? Effective protection against advanced attacks, including Power Analysis and Fault
Attacks of various kinds
? Multiple logical and physical protection layers, including metal shielding, end-to-end
encryption, memory encryption, tamper detection
? Support for RSA and ECC asymmetric cryptography algorithms, future proof curves
and high key length, e.g. Brainpool, Edwards and Montgomery curves
? Support for AES and DES symmetric cryptographic algorithms for encryption and
decryption
? Support for AES Modes: CBC, ECB, CTR
? HMAC, CMAC, SHA-1, SHA-224/256/384/512 operations
? Various options for key derivation functions, including HKDF, MIFARE KDF, PRF (TLSPSK)
? Extended temperature range for industrial applications (-40 °C to +105 °C)
? Small footprint HX2QFN20 package (3x3 mm)
? Standard physical interface I2C target (High-speed mode, 3.4 Mbps), I2C controller
(Fast mode, 400 kbps). Both can be active at the same time
? Dedicated CL wireless interface for IoT use cases simplifying configuration set-up,
maintenance in the field and late stage configuration
? Secured user flash memory up to 50 kB for secure data or key storage
? Support for SCP03 protocol (bus encryption and encrypted credential injection) to
securely bind the host with the secure element
? TRNG compliant to NIST SP800-90B
? DRBG compliant to NIST SP800-90A
? Support for applet level secure messaging channels to allow end-to-end encrypted
communication in multi-tenant ecosystems
? In 2022 NXP launched a new generation of product variants, the SE050E platform. The
SE050E platform supports the following new features.
– AES Modes: CCM and GCM
– GMAC
– EC Curves for ECDH: Curve448
? Matter Ready: SE050 provides the necessary cryptographic functions to support the
upcoming Matter standard for connecting smart home devices.
供應(yīng)商 | 型號(hào) | 品牌 | 批號(hào) | 封裝 | 庫(kù)存 | 備注 | 價(jià)格 |
---|---|---|---|---|---|---|---|
SE051B00 |
14 |
14 |
詢(xún)價(jià) | ||||
NXP |
22+ |
NA |
1942 |
原裝正品支持實(shí)單 |
詢(xún)價(jià) | ||
DENSO |
23+ |
DIP8 |
8820 |
全新原裝優(yōu)勢(shì) |
詢(xún)價(jià) | ||
DENSO |
24+ |
DIP-8 |
16800 |
絕對(duì)原裝進(jìn)口現(xiàn)貨,假一賠十,價(jià)格優(yōu)勢(shì)!? |
詢(xún)價(jià) | ||
NXP |
24+ |
- |
3376 |
專(zhuān)注NXP品牌原裝正品代理分銷(xiāo),認(rèn)準(zhǔn)水星電子 |
詢(xún)價(jià) | ||
YAGEO/國(guó)巨 |
23+ |
NA/ |
13250 |
原廠(chǎng)直銷(xiāo),現(xiàn)貨供應(yīng),賬期支持! |
詢(xún)價(jià) | ||
YAGEO/國(guó)巨 |
N/A |
90000 |
集團(tuán)化配單-有更多數(shù)量-免費(fèi)送樣-原包裝正品現(xiàn)貨-正規(guī) |
詢(xún)價(jià) | |||
NXP(恩智浦) |
23+ |
NA/ |
7350 |
現(xiàn)貨供應(yīng),當(dāng)天可交貨!免費(fèi)送樣,原廠(chǎng)技術(shù)支持!!! |
詢(xún)價(jià) | ||
TDK FG23X7S2A106KRT06 FG23X7S2 |
AVX Multilayer Ceramic Capacit |
20000 |
全新原裝現(xiàn)貨 樣品可售 |
詢(xún)價(jià) | |||
TE |
24+ |
SMD |
400 |
C02-集成電路(IC) |
詢(xún)價(jià) |